Semiconductor Manufacturing Equipment Market Size, Industry Analysis Report, Regional Outlook, Application Development Potential, Price Trend, Competitive Market Share & Forecast, 2020 - 2026
Report ID: GMI4233
Semiconductor Manufacturing Equipment Market size will develop rapidly from 2019 to 2025 led by increasing demand for semiconductor applications in automotive, consumer goods, and electronics industries. The growing number of data centers & servers across the globe is driving the utilization of semiconductors for energy-saving applications, contributing to industry development. The industry growth is attributed to the rising demand for semiconductor chips in electric vehicles, solar panels, wind turbines, and smart panels. The growing consumer electronics industry across the globe due to the rise in the household disposable income is increasing the demand for semiconductors across the globe, providing lucrative growth opportunities to the semiconductor manufacturing equipment market.
The demand for semiconductors is increasing in IoT devices such as smart wearables, smart homes, and smart TVs. The growing utilization of IoT technologies across industries will drive market growth. However, the major factor restraining market growth is the high cost and maintenance associated with these devices. Technical problems, such as wafer fab processing and scheduling of wafers, are faced during the fabrication process of this equipment, hampering the semiconductor manufacturing equipment market expansion.
The lithography equipment segment is expected to grow at higher rates over the forecast period. The growth is attributed to extensive research & development in the field. As per the data shared by the Semiconductor Industry Association, in 2018, the global semiconductor industry accounted for over USD 450 billion. The demand for semiconductors is increasing in telecommunication, automotive, consumer durables, and memory devices, rising the demand for cost-effective Integrated Circuit (IC) manufacturing systems. The industry is witnessing an exponential rise in the investments for upgrading and constructing semiconductor plants (foundries). For instance, in December 2018, Intel Corporation announced the investment of over USD 70 million for its chip manufacturing plant expansion to meet the changing market demands.
The demand for wafer bonding equipment is increasing across industries to ensure reliability and efficient productivity. The bonding systems are used for several applications such as wafer alignment, surface preparation & cleaning, post-bond metrology & wafer bonding, etc. Standardization is highly valued by silicon foundries and integrated system manufacturers, supporting the adoption of bonding equipment. The increasing utilization of various types of semiconductor ICs for several automotive functions such as ABS, power doors, airbag control, and car navigation will fuel the demand for reliable and energy-efficient semiconductor devices, surging the demand for advanced bonding systems.
The Asia Pacific semiconductor manufacturing equipment market is expected to witness high growth owing to growth in the semiconductor industry and the presence of a number of equipment manufacturers. The rising financial support from Asian governments is encouraging companies to invest in the construction of new semiconductor fabrication plants in the region. The Indian government is supporting the construction of semiconductor fabrication facilities by using the emerging technology of Gallium Nitride semiconductor fab. Additionally, in May 2018, the Chinese government announced the investment of USD 50 billion to improve its ability to design, develop, and manufacture semiconductor chips. Such initiatives by governments are expected to contribute to the market growth in the region. Additionally, the rising demand for smartphones, tablets, and PCs in Japan, India, and China due to the growing number of technologically aware population will drive the demand for advanced semiconductor chips in the region.
The leading companies operating in the semiconductor manufacturing equipment market include Applied Materials Inc., ASML Holdings N.V., Tokyo Electron Ltd., Hitachi High-Technologies Corporation, Teradyne Inc., LAM RESEARCH Corporation, Advantest Corporation, KLA-Tencor Corporation, and Screen Holdings Co. Ltd. Several companies are developing products with advanced features to meet changing consumer demands. For instance, in July 2016, Applied Materials Inc. introduced a new PROVision machine, which is an addition to its e-beam inspection system that delivers the highest image quality and resolution at the fastest throughput. The system is also anticipated to offer three times faster throughput for challenging e-beam applications. Companies are also focusing on strategies, such as mergers & acquisitions and strategic partnerships & collaborations, to sustain market growth. For instance, in November 2017, ASML Holding N.V. announced the acquisition of Hermes Microvision Inc. to expand its business operations in Taiwan.
The semiconductor manufacturing equipment market research report includes in-depth coverage of the industry with estimates & forecast in terms of revenue in USD from 2015 to 2025 for the following segments:
By Equipment Type
- Lithography Equipment
- Wafer Surface Conditioning Equipment
- Dicing Equipment
- Bonding Equipment
- Cleaning Equipment
- Test Equipment
By End Use
- Semiconductor Fabrication Plant/Foundry
- Semiconductor Electronics Manufacturing
- Test Home
The above information is provided for the following regions and countries:
- North America
- Asia Pacific
- South Korea
- Latin America
- Middle East & Africa
- Saudi Arabia
- South Africa
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