Advanced Packaging Market Size By Packaging Type (Flip-chip, Fan-in Wafer Level (WLP) Packaging, Embedded-die, Fan-out, 2.5 Dimensional / 3 Dimensional), By Application (Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace& Defense), COVID-19 Impact Analysis, Regional Outlook, Application Potential, Competitive Market Share & Forecast, 2020 – 2026

Industry Statistics

Advanced Packaging Market size exceeded USD 25 billion in 2019 and is estimated to grow at over 8% CAGR between 2020 and 2026. Rising inclination toward the adoption of the Internet of Things (IoT) and connected technology across the globe will add an impetus to the industry.
 

Adding to this, several initiatives by the governments toward the adoption of IoT technologies will drive the market demand. The transition toward More than Moore’s approach with continual change in nodes and wafer size is accelerating the adoption of advanced packaging in foundries.
 

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The COVID-19 pandemic has led majority of chip manufacturers to face problems while sourcing raw materials and maintaining test operations, declining the advanced packaging market revenue. The nationwide lockdown imposed by several governments has resulted in the shutdown of various fab facilities and a shortage of fab operators and engineers. Furthermore, IDMs and foundries are experiencing a declining demand for advanced packaging due to the decreasing production capacity among the consumer electronics, automotive, and other industries.
 

Rising adoption of flip-chip packaging in automotive applications

The flip-chip type segment is projected to expand at around 5% growth rate through 2026. The rising adoption of compact semiconductor components used in high-performance applications such as automotive and aerospace & defense will fuel the advanced packaging market statistics. Flip-chip advanced packaging offers a small footprint and high input/output density that increases their adoption by several foundries and IDMs.
 

Rising integration of compact devices to foster demand across consumer electronics industry

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Consumer electronics application segment is forecast to register 7% gains till 2026 propelled by the rising trend of compact electronic devices. These packaging types aid to reduce packaging size, increase chip connectivity, improve reliability, and offer multi-function integration, accelerating their demand in smartphones and smartwatches.
 

The consumer electronics players in the U.S. are inclined toward the adoption of these advanced packaging technologies in their newly launched models to gain high competitiveness in the market.
 

Presence of major foundry players in Asia Pacific region

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The Asia Pacific advanced packaging market captured about 70% of the revenue share in 2019. Rising production of semiconductor components and consumer electronic devices in China, Taiwan, and South Korea is boosting the regional market share. The region also includes some of the major foundry providers, such as Global Foundries, TSMC, and UMC, among others, accelerating market expansion opportunities. South Korea held majority share in the region on account of several initiatives by the government.
 

Focus on business expansion to stay competitive in the market

Major players in the advanced packaging market include ASE Group, ChipMOS Technologies Inc., Sanmina Corporation, Siliconware Precision Industries Co., Ltd., among others. Companies are continuously focusing on technological innovations and business expansion to accelerate their position in the market.
 

This market research report on advanced packaging includes in-depth coverage of the industry with estimates & forecast in terms of revenue in USD from 2016 to 2026 for the following segments:

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Market, By Packaging Type

• Flip-chip
• Fan-in WLP
• Embedded die
• Fan-out
• 2.5D/3D

Market, By Application

• Consumer electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & defense
• Others

The above information has been provided for the following regions and countries:

• North America
  • U.S.
  • Canada
• Europe
  • UK
  • Germany
  • France
  • Italy
  • Netherlands
• Asia Pacific
  • China
  • Japan
  • South Korea
  • Taiwan
• LAMEA
  • Argentina
  • Mexico
  • Israel