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    Through-Silicon Via (TSV) Technology Market

    Published Date: December 2025   |   Pages 170
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    The global through-silicon via (TSV) technology market was estimated at USD 3.1 billion in 2025. The market is expected to grow from USD 3.8 billion in 2026 to USD 10.5 billion in 2031 and USD 23.7 billion by 2035, at a CAGR of 22.5% during the forecast period of 2026–2035...

    Heterogeneous Integration Technology Market

    Published Date: December 2025   |   Pages 185
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    The global heterogeneous integration technology market was valued at USD 14.4 billion in 2024. The market is expected to grow from USD 16.2 billion in 2025 to USD 30.3 billion by 2030 and USD 50.6 billion by 2034, growing at a CAGR of 13.5%, during the forecast period of 2025-2034...

    Advanced Packaging Market

    Published Date: February 2025   |   Pages 190
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    The global advanced packaging market was valued at USD 38.5 billion in 2024 and is estimated to grow at a CAGR of 11.5% to reach USD 111.4 billion by 2034...

    Atomic Layer Deposition Equipment Market

    Published Date: January 2025   |   Pages 198
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    The global atomic layer deposition equipment market was valued at USD 4.3 billion in 2024 and is anticipated to grow at a CAGR of 10.6% between 2025 to 2034...

    Semiconductor & IC Packaging Materials Market

    Published Date: October 2024   |   Pages 230
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    The global semiconductor & IC packaging materials market size was valued at USD 4.1 billion in 2023 and is expected to grow at a CAGR of over 10% between 2024 and 2032. ..

    Interposer and Fan-out WLP Market

    Published Date: February 2024   |   Pages 250
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    Interposer and Fan-Out Wafer-Level Packaging Market was valued at over USD 30 billion in 2023 and is estimated to register a CAGR of over 12% between 2024 & 2032. ..

    Flexographic Printing Market

    Published Date: September 2023   |   Pages 250
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    Flexographic Printing Market size was valued at over USD 8.5 billion in 2022 and is estimated to register a CAGR of over 14% between 2023 and 2032. ..

    3D IC and 2.5D IC Packaging Market

    Published Date: June 2023   |   Pages 252
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    3D IC and 2.5D IC packaging market was valued at over USD 45 billion in 2022 and is anticipated to grow at a CAGR of over 9% between 2023 and 2032. ..

    Digital Printing Packaging Market

    Published Date: May 2023   |   Pages 250
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    Digital Printing Packaging Market size was valued at over USD 18 billion in 2022 and is anticipated to grow at a CAGR of over 6% between 2023 and 2032. ..

    Fan-Out Wafer Level Packaging Market

    Published Date: May 2023   |   Pages 240
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    Fan-Out Wafer Level Packaging Market size was valued at over USD 2.5 Billion in 2022 and is anticipated to grow at a CAGR of over 10% between 2023 and 2032. ..

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