Envelope Tracking Chip Market Size - By Frequency Range, By Application, By End Use Industry – Global Forecast, 2025 – 2034

Envelope Tracking Chip Market Size

The global envelope tracking chip market size was valued at USD 18.7 billion with 6.4 billion units in 2024 and is estimated to grow at 10.4% CAGR from 2025 to 2034. The global rollout of 5G networks is driving the need for power-efficient RF components in smartphones.
 

The tariffs by the Trump administration on the semiconductor chips has led to higher manufacturing cost of envelop tracking chips for the domestic manufacturers. This has resulted in shifting the current supply chain for imports of semiconductors. The cost of 5G infrastructure has risen significantly as the domestic manufacturers in US depend on the RF chips from China. Though the positive result of this being US shifting to domestic investments along with partnering Vietnam, India, and Taiwan, mitigating the tariff-related risks.
 

The envelope tracking chips reduce power consumption by power amplifiers by 40% which results in extension of the smartphone’s battery life. Envelope tracking chips ensure the high performance without excess heat generation along with meeting the 5G devices requirement of multiband RF frontends. According to Statista, the global smartphones market is projected to reach USD 485.3 billion by 2025. The market is fueled as the leading smartphone manufacturers such as Apple, Samsung, and Xiaomi integrate envelope tracking solutions. The shift on the artificial intelligence operated envelope tracking is expected to further boost the envelope tracking chip market.
 

The deployment of 5G base stations and small cells globally for the telecom infrastructure is fueling the market. Open RAN (radio access network) architecture prioritizes energy efficiency, where envelope tracking plays a key role in reducing operational costs for operators. Massive MIMO and beamforming technologies in 5G require high-efficiency power amplifiers, further propelling envelope tracking adoption. Governments and telecom giants are investing heavily in 5G, particularly in urban and industrial zones, creating sustained demand. Analog Devices and Qualcomm Technologies, Inc. are leading suppliers of envelope tracking solutions, ensuring robust growth.
 

The automotive industry’s shift toward connected and autonomous vehicles is driving envelope tracking chip demand for radar and 5G-V2X (vehicle-to-everything) systems. Envelope tracking improves the efficiency of 24 GHz and 77 GHz radar modules, essential for ADAS and self-driving cars. Regulatory mandates in the EU and China for V2X deployment are accelerating adoption. As automakers integrate more 5G telematics, the need for low-latency, high-efficiency envelope tracking chips grows.
 

Increasing defense budgets and the rise of LEO (Low-Earth Orbit) satellite constellations are fueling demand for high-performance ET chips. Military applications, such as AESA radars and electronic warfare systems, rely on GaN-based ET for superior power efficiency and thermal management. Satellite operators like Starlink and OneWeb use envelope tracking -enabled power amplifiers to enhance signal integrity while minimizing energy use. Geopolitical tensions and space commercialization are further driving investments in this sector.
 

To capitalize on the growing envelope tracking chip market, players should focus on developing AI-driven dynamic envelope tracking solutions for 5G smartphones to enhance power efficiency and differentiate offerings. Investing in gallium nitride (GaN) based envelope tracking chips for defense and satellite applications can unlock high-margin opportunities, given the surge in military modernization and LEO satellite deployments. Additionally, forging partnerships with automotive OEMs and telecom infrastructure providers will be critical to address the rising demand for V2X and Open RAN-compatible envelope tracking solutions. 
 

Envelope Tracking Chip Market Trends

• The adoption of AI-driven dynamic envelope tracking is emerging as a key trend, enabling real-time optimization of power amplifier efficiency based on usage patterns. Machine learning algorithms are being embedded into envelope tracking ICs to predict and adjust voltage levels, reducing energy waste in 5G and IoT devices. This innovation is particularly valuable for smartphones and base stations, where power consumption is critical. Leading players like Qualcomm and Analog Devices are investing heavily in AI-enhanced envelope tracking solutions to gain a competitive edge.
   
• There is a growing shift toward integrating envelope tracking functionality directly into RF power amplifier modules to save space and improve performance. This trend is driven by the demand for smaller, more efficient components in compact devices like wearables and IoT sensors. Advanced packaging technologies, such as wafer-level packaging, are enabling this miniaturization. Companies like Qorvo and Skyworks are at the forefront, developing highly integrated envelope tracking solutions for next-gen applications.
   
• Beyond traditional 5G and automotive uses, envelope tracking chips are finding new applications in Wi-Fi 7 routers, AR/VR headsets, and industrial robotics. These markets require high-efficiency power management to handle increasing data rates and complex workloads. The rise of edge computing and low-latency communication is further fueling this diversification. Startups and established players alike are exploring these niches to unlock additional growth opportunities.
   

Envelope Tracking Chip Market Analysis

Based on frequency range, the market is divided into up to 6 GHz, 6 - 24 GHz, and above 24 GHz.
 

• The market for up to 6 GHz frequency range was valued at USD 14 billion in 2024. The up to 6 GHz frequency range dominates the global envelope tracking (ET) chip market due to its critical role in 5G smartphones, LTE networks, and Wi-Fi 6/7 devices. Envelope tracking chips in this band optimize power amplifier efficiency, reducing energy consumption by 30–40% in multi-band RF front ends. Demand is driven by mass adoption of Sub-6 GHz 5G in Asia-Pacific and North America, where carriers prioritize coverage over mmWave. Key players like Qualcomm, Qorvo, and Skyworks integrate advanced envelope tracking solutions to support carrier aggregation and dynamic spectrum sharing. Growth is further fueled by AI-driven envelope tracking algorithms that adapt to real-time network conditions, ensuring peak performance in high-traffic scenarios.
   
• The market for above 24 GHz frequency range is projected to grow at a CAGR of 13.1% by 2034. The above 24 GHz (mmWave) frequency range is a high-growth segment in the global Envelope Tracking chip market, driven by ultra-fast 5G mmWave deployments and satellite communications. ET chips in this band face thermal and efficient challenges, yet advancements in GaN (gallium nitride) technology are enabling higher power density and better heat dissipation. Key applications include urban 5G hotspots, fixed wireless access (FWA), and military radar systems, where low-latency, high-throughput performance is critical. Leading players like Analog Devices, Broadcom, and Samsung are pioneering mmWave-optimized envelope tracking solutions to support beamforming and massive MIMO architectures.
   

Based on application, the envelope tracking chip market is divided into smartphones & mobile devices, base stations & telecom infrastructure, IoT & wearables, vehicles, military radars, medical devices, others.
 

• The market for smartphones & mobile as application was valued at USD 11.5 billion in 2024. Smartphones & mobile devices dominate the market, driven by 5G adoption and multi-band RF front-end complexity. Envelope tracking chips enable 30-40% power savings in power amplifiers, extending battery life for flagship and mid-tier 5G smartphones. Key players like Qualcomm, Qorvo, and Skyworks integrate ET into modem-RF systems for OEMs like Apple, Samsung, and Xiaomi.
   
• The envelope tracking chip market for vehicles as an application is projected to grow at a CAGR of 16.2% by 2034. Vehicles are emerging as a high-growth segment in the market, driven by 5G-V2X and autonomous driving trends. Envelope tracking chips optimize power efficiency in automotive radar (24/77 GHz) and telematics systems, enabling real-time connectivity for safety and navigation. With EU and China mandating V2X deployment, demand for envelope tracking enabled RF solutions in cars is accelerating. Key suppliers like NXP, Infineon, and Qualcomm are developing automotive-grade ET chips for next-gen vehicles.
   

Based on end use industry, the envelope tracking chip market is divided into consumer electronics, telecom, automotive, industrial, defense & aerospace, healthcare, and others.
 

• The market for consumer electronics as an end use industry was valued at USD 12.3 billion in 2024. Consumer electronics hold highest market share in envelope tracking due to 5G smartphones, Wi-Fi routers, and AR/VR devices. The envelope tracking technology ensures longer battery life and reduced heat generation in these devices during high bandwidth activities. The leading smartphone brands such as Apple, Samsung, and Xiaomi procure the envelope tracking chips from Qualcomm and Skyworks for their premium and conventional products.
   
• The market for telecom as an end use industry is projected to grow at a CAGR of 12.2% by 2034. Telecom infrastructure is driven by the deployment of 5G network and Open RAN (Radio Access Network) adoption. The envelop tracking chips reduce heat generation by Open RAN (Radio Access Network) adoption, which results in enhanced energy efficiency reducing operational costs. The key players in the market such as Analog Devices, and Qorvo meet the envelop tracking chips requirement of the infrastructure providers. The market further gets the boost by sustainability mandates and network densification.
   

• The U.S. envelope tracking chip market is projected to reach USD 11.5 billion by 2034. The CHIPS Act is boosting domestic production of advanced RF components, including envelope tracking ICs. AI-driven dynamic envelope tracking for smartphones (e.g., Qualcomm’s Snapdragon) is a key growth area. The market for envelop tracking chips is led by the US due to defense requirements and 5G deployments by firms such as Verizon and T-Mobile. Key players in the market, for instance Qorvo and Analog Devices dominate the market with gallium nitride (GaN) based envelope tracking solutions for radar and satellite communications.
   
• The Germany envelope tracking chip market is expected to grow at a CAGR of 9.4% by 2034. Germany is Europe’s hub for automotive-grade envelope tracking chips, with Infineon and Bosch developing V2X-enabled solutions for BMW and Mercedes. The country’s 5G industrial automation push is driving demand for energy-efficient ET in private networks. Strict EU energy regulations are accelerating adoption of envelope tracking in base stations.  
   
• The U.K. envelope tracking chip market is expected to grow at a CAGR of 9.8% by 2034. The U.K. focuses on Open RAN compatible envelope tracking chips, with startups innovating for telecom infrastructure. The government’s ~USD 280 million 5G diversification strategy supports local envelope tracking R&D, targeting Huawei alternatives. Key trials involve BT and Vodafone for energy-efficient mMIMO systems. The defense sector uses envelope tracking for radar in Tempest fighter jets.
   
• The China envelope tracking chip market was valued at USD 3.4 billion in 2024. China dominates consumer envelope tracking chip production, supplying for global smartphone demand (Xiaomi, Oppo, Vivo). Huawei’s HiSilicon designs in-house ET for 5G base stations, despite U.S. sanctions. State-backed manufacturers are advancing GaN envelope tracking for mmWave and satellite comms. The "China Standard 2035" plan prioritizes self-reliance in RF semiconductors.  
   
• The envelope tracking chip market in India is expected to grow at a CAGR of 11.6% by 2034. India’s ET chip demand surges with Reliance Jio’s 5G rollout and local smartphone manufacturing (production linked incentive scheme). The government’s USD 10 billion semiconductor mission aims to establish local ET chip fabrication. Key partnerships with Qualcomm and MediaTek target affordable 5G devices.
   

Envelope Tracking Chip Market Share

The market is highly competitive. The top 5 players Qualcomm Technologies, Inc., Qorvo, Inc., Skyworks Solutions, Inc., Texas Instruments, and Analog Devices, Inc. dominate with a combined market share of over 54%, leveraging their advanced RF and power management technologies. These leaders are deploying strategies like AI-driven dynamic envelope tracking and GaN integration to enhance power efficiency in 5G and IoT devices.
 

To differentiate offerings, companies are investing in ultra-compact designs for smartphones and mmWave-optimized solutions for telecom infrastructure. Customized envelope tracking chips for automotive V2X and defense applications are also gaining traction. Strategic collaborations with OEMs (e.g., Apple, Samsung) and acquisitions (e.g., Qorvo’s RFMD buyout) are key to expanding market reach.
 

Automation and advanced packaging (e.g., wafer-level integration) are being adopted to reduce costs and meet demand for high-volume production. Additionally, firms are aligning with sustainability goals by minimizing energy waste in 5G networks and consumer electronics, addressing both regulatory and consumer preferences.
 

Envelope Tracking Chip Market Companies

Some of the prominent market participants operating in the envelope tracking chip industry include:

• Qualcomm Technologies, Inc.
• Qorvo, Inc.
• Skyworks Solutions, Inc.
• Texas Instruments
• Analog Devices, Inc.
   

Qualcomm dominates the envelope tracking chip market through its Snapdragon modem-RF systems, integrating AI-driven ET for 5G smartphones and automotive applications. The company leverages deep system-level expertise to optimize power efficiency in multi-band 5G devices, serving OEMs like Samsung and Xiaomi. Its Hexagon DSP-powered ET algorithms dynamically adjust voltage, reducing power amplifier’s (PA) power consumption by up to 40%. Qualcomm is expanding into mmWave ET solutions for urban 5G densification and satellite communications. Strategic partnerships with TSMC ensure cutting-edge 4nm/3nm process nodes for next-gen ET chips.
 

Qorvo specializes in GaN-based ET solutions for defense, aerospace, and high-frequency 5G infrastructure. Its RF Fusion platforms combine ET with PAs and filters, targeting premium smartphones (e.g., Apple iPhones) and Open RAN deployments. The company leads in radiation-hardened ET chips for military radar and LEO satellites, backed by U.S. defense contracts. Qorvo’s acquisition of RFMD strengthened its analog ET IP portfolio, enabling hybrid architectures. Investments in automotive radar ET (77 GHz) position it for growth in autonomous driving.
 

Envelope Tracking Chip Industry News

In March 2025, Murata developed the first digital envelope tracking (ET) technology to enhance power efficiency in 5G and future 6G RF circuits. The system integrated a proprietary power management IC with a digital pre-distortion algorithm to reduce power consumption and signal distortion. Murata collaborated with Rohde & Schwarz to create a high-precision RF measurement setup for evaluating the technology's real-world performance.
 

The envelope tracking chip market research report includes an in-depth coverage of the industry with estimates and forecast in terms of revenue (USD billion) and volume (billion units) from 2021 to 2034, for the following segments:

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Market, By Frequency Range

• Up to 6 GHz
• 6 - 24 GHz
• Above 24 GHz

Market, By Application

• Smartphones & mobile devices
• Base stations & telecom infrastructure
• IoT & wearables
• Vehicles
• Military radars
• Medical devices
• Others

Market, By End Use Industry

• Consumer electronics
• Telecom
• Automotive
• Industrial
• Defense & aerospace
• Healthcare
• Others

The above information is provided for the following regions and countries:

• North America 
  • U.S.
  • Canada
• Europe 
  • Germany
  • UK
  • France
  • Spain
  • Italy
  • Netherlands
• Asia Pacific 
  • China
  • India
  • Japan
  • Australia
  • South Korea
• Latin America 
  • Brazil
  • Mexico
  • Argentina
• Middle East and Africa 
  • Saudi Arabia
  • South Africa
  • UAE