Copper Clad Laminates Market size was over USD 11 billion in 2018 and is projected to expand at over 4.5% CAGR over the forecast timeframe.
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Advanced development of semiconductor fabrication technology, electronic assembly technology as well as electronic machine products in addition to printed circuit boards (PCB) fabrication technology are the prime factors which will drive global copper clad laminates market in the coming years. Copper clad lamination offers excellent insulation, conductivity, signal and support transmission which makes it a fundamental raw material for PCB fabrication. Thus, constant advancement of PCB boards and their growing demand in terminal electronic products will positively impact product market during the forecast spell. Furthermore, rapid expansion of downstream electronics information industry such as optical information storage systems and vacuum fluorescent displays, along with substantial expansion of various end-use sectors will positively drive the product market in the near future.
|Market Size in 2018:||11 Billion (USD)|
|Forecast Period:||2019 to 2025|
|Forecast Period 2019 to 2025 CAGR:||4.5%|
|2025 Value Projection:||15 Billion (USD)|
|Historical Data for:||2014 to 2018|
|No. of Pages:||310|
|Tables, Charts & Figures:||849|
|Segments covered:||Product, Reinforcement Material, Resin, Application and Region|
|Pitfalls & Challenges:|
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Copper clad lamination demand has gained momentum over the recent years. Owing to the rising demand for 5G infrastructure materials, which will further accelerate the product market size during the anticipated timeframe. Demand for high-frequency transmission network in 5G communication will diminish the distance for signal transmissions and increases the density of receiving signal and transmitting nodes, which in turn will increase the demand of copper clad laminations for 5G communications equipment in the coming few years.
Escalating China–United States trade war may restrain the product market growth in the near term. The economic conflict has increased tariff on various Chinese goods and China being the major supplier in the copper clad laminates market could possibly increase the product prices in various regions to offset its losses in trade wars. Nevertheless, rapid expansion of electronic packaging technology will drive copper clad lamination demand towards reduced size, high speed, light weight, endurance to high temperature, highly thermal dissipation, Conductive Anodic Filament (CAF) resistance, Comparative Tracking Index (CTI) resistance, high modulus, high intensity, high reliability and multiple functional printed circuit boards during the forecast period.
Based on product type, the market is mainly classified into two types i.e., rigid and flexible copper clad laminates. Here, rigid CCLs dominate the segment and holds more than half of the market volume. Rigid CCLs include metal substrate, build-up multilayer substrate, thermoplastic substrate, ceramic substrate, capacitor embedded substrate, etc. which makes it suitable for various applications such as computers, communication system and consumer appliances. Whereas, flexible CCLs in the segment will drive the product market at a significant rate during the anticipated timeframe. This is due to its growing usage in vehicle technology and healthcare devices.
On the basis of reinforcement material, the market is classified into glass fiber, paper base and compound materials. Here, glass fiber reinforcement material generates maximum revenue over USD 6 billion owing to its excellent heat resistance, dimensional stability and high electrical insulation properties, which increases its demand as a reinforcement material in various applications. Glass fiber reinforcement material is then followed by paper based reinforcement material which holds a significant share in the product market.
The market is segmented into epoxy, phenolic, polyamide and other resins, that includes phenol, polyester, etc. Epoxy resin holds maximum share of more than 4.5% of the product market, owing to its good electrical, mechanical and bonding properties in addition to this it also offers chemical resistance, which increases its usage demand in in the manufacture of copper clad laminates. Epoxy is then followed by phenolic resins which illustrates a significant growth in its CAGR during the anticipated timespan.
Copper clad laminates market segment by application is categorized into computers, communication system, consumer appliances, vehicle electronics, healthcare devices, defense technology and other applications, which includes aerospace and space explorations. Here, vehicle electronics generates maximum revenue over USD 2.5 billion owing to rapidly rising automotive industry and with the introduction of e-vehicles the segment is further expected to gain momentum in the near-term. Furthermore, the consumer appliance in the segment is likely to growth with the highest rate owing to growing use of mobile phones in the segment, which in turn will boost the demand for global copper clad laminations in the market.
Asia pacific is leading the global copper clad laminates market share. This is because it is a well-established hub for various applications, such as communication system, vehicle electronics, healthcare technology, defense and aerospace sector. Moreover, growing demand for 5G communications and e-vehicle in the region will further drive the product market for various applications during the forecast period. Asia-Pacific is then followed by North America which illustrates a significant growth in its CAGR during the anticipated timespan.
The key manufacturers in copper clad laminates market share include Shandong Jinbao Electronics Co., Ltd., Taiwan Union Technology Corporation, Guangdong Chaohua Technology Co., Ltd., Doosan Corporation, Grace Electron, NAN YA Plastics Industrial Co., Ltd. Isola Group, Panasonic Corporation, ITEQ Corporation, Sytech technology Co., Ltd., Cipel Italia.
Copper clad laminates are a board type materials that act as the major raw materials in printed circuit boards. These are extensively applied in the PCBs, as it provides insulation, conductivity, signal transmission, influencing PCB performance and a long term durability. Copper clad laminates are basically of two types i.e. rigid and flexible, that are used to make rigid, flexible and flex-rigid PCBs. CCLs are reinforced with glass fibers, paper based materials and compound materials. It is then soddened with different resins such as epoxy, polyimide, phenolic etc. These laminates are widely applied in the PCBs that are used in computers, communication systems, consumer appliances, vehicle electronics, healthcare devices, defense technologies etc.