Extreme Ultraviolet (EUV) Lithography Market Size - By Component, By Equipment Type, By Technology Node, By End Use - Global Forecast, 2025 - 2034

Extreme Ultraviolet Lithography Market Size

The global extreme ultraviolet lithography market accounted for USD 11.4 billion in 2024. The market will grow from USD 12.6 billion in 2025 to USD 21.8 billion in 2030 and USD 34.6 billion in 2034 at a Compound Annual Growth Rate (CAGR) of 11.8% over the forecast period of 2025–2034, according to Global Market Insights Inc.

• The worldwide extreme ultraviolet lithography market is experiencing rapid growth because of its pivotal position in the development of next-generation semiconductor production. The semiconductor manufacturing ecosystem requires very high optical accuracy & nanometer-level resolution, particularly with chipmakers moving towards 5 nm & 3 nm process nodes for AI, autonomous systems, & high-performance computing. EUV lithography supports greater component density, better yield, & better chip performance that directly benefits this change. Thus, High demand for integrated device manufacturers and foundries for production of advanced, complex integrated circuits (ICs) is expected to increase
   
• Growing demand for Sub-5nm and Sub-3nm Node Semiconductor Manufacturing, growing AI, HPC, and 5G Chip Demand, and government incentive packages to semiconductor industry, ASML monopolized tool supply and tech innovations and growth of foundry and IDM Capex in the Asia-Pacific and North America are the key drivers of growth which is propelling the market.
   
• In 2024, SEMI announced that worldwide semiconductor equipment billings increased to USD 117.1 billion, a growth of 10% from the last year, led by spending on AI & logic/memory capacity. China, South Korea, & Taiwan contributed about 74% of the total market, with China leading regional expenditures of USD 49.6 billion, up by 35% from the last year. North America also recorded growth of approximately USD 13.7 billion, a 14% year-over-year growth driven mainly by CHIPS Act–incentivized spending. In that, EUV-specific hardware critical to advanced sub-7 nm lithography is a large fraction of the high-end wafer fab equipment segment, which accounted for more than 90% of wafer-processing tool expenditures, highlighting Asia-Pacific's leading position in EUV tool adoption and North America's increasing utilization through CHIPS-funded fabs.
   

Extreme Ultraviolet Lithography Market Trends

• EUV lithography is gaining traction across sub-5nm & sub-3nm semiconductor manufacturing operations worldwide due to the high demand for higher pattern resolution, stricter dimensional tolerances, & manufacturing yields. Since 2020, leading foundries in APAC, North America, & Europe have adopted EUV for logic & memory manufacturing. This trend is likely to continue in intensity during the period up to 2030, as semiconductor manufacturers shift towards 2nm and sub-2nm nodes, where conventional lithography methods fail to provide the required fidelity and cost-effectiveness.
   
• Material and equipment suppliers must concentrate on developing high-NA EUV systems, pellicles, mirrors, and photoresists to support high-volume production at next-generation nodes. Greater optical throughput, thermal reliability, and defect control will be needed. Strategic partnerships between equipment suppliers, foundries, and materials providers will drive the maturity and commercial scalability of EUV platforms more quickly, positioning stakeholders for long-term value capture in the semiconductor value chain.
   
• Advanced computational methods & machine learning are making intelligent lithography increasingly popular. These techniques promise real-time process correction, enhanced defect prediction, tighter overlay control, and higher wafer yields. Logic and DRAM manufacturers are driving tighter integration and more density, and AI-enabled lithography will be a core enabler for high-precision manufacturing in AI, 5G, and HPC-related chipsets.
   
• EUV lithography is gradually transitioning from pilot production to commercial deployment. Vendors are spending heavily on designing pellicles and optical components to support higher photon flux and power density. Advances in these areas are essential to bringing consistent performance and throughput with larger volumes of production, which is a necessary requirement for commercial-scale adoption by top fabs in Taiwan, South Korea, Japan, and the U.S.
   
• Digital twin simulation software and integrated lithography management systems are revolutionizing calibration, optimization, and maintenance of EUV tools. Such software-based solutions provide increased process predictability, uptime, and fault detection that are especially beneficial for high-mix, low-defect usage. Since 2020, top fabs and OEMs have embraced such solutions to reduce total cost of ownership and enhance lithography ROI, a trend likely to persist through 2030.
   

Extreme Ultraviolet Lithography Market Analysis

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Based on components, the market is segmented into light source, EUV mask, EUV optics, metrology equipment and others. The EUV mask segment accounts for the highest market share of 25% and the metrology equipment segment is the fastest-growing segment with a CAGR of 13.2% during the forecast period.
 

• In 2024, the light source segment dominated the extreme ultraviolet (EUV) lithography market with an estimated value of USD 4.3 billion, driven by the critical need for high-powered EUV light sources to achieve the throughput and resolution required for advanced nodes at 5nm and below. Manufacturers are investing heavily to increase light source power (measured in watts) and enhance stability, which directly improves wafer patterning accuracy and process efficiency. Technological advancements, particularly in laser-produced plasma (LPP) systems, have further boosted productivity by increasing uptime and reliability. As the light source is essential for scaling EUV technology in high-volume manufacturing (HVM), these improvements are key factors fueling the growth and dominance of this segment within the market.
   
• Additionally, the light source segment flourishes with the kind of partnerships OEMs of lithographic systems form with component suppliers to promote integrated solutions. As an example, ASML continues to be a partner with Cymer (subsidiary of ASML) that has continuously improved the light source power that exceeds 400W. This improvement is allowing fab factories to produce more wafers per hour. The increasing need for next-generation chips in AI, 5G, & HPC is fueling growth in reliable and high-intensity EUV light sources.
   
• The metrology equipment segment is one of the fastest-growing categories in the market and is projected to expand to a CAGR of 13.2% during the forecast period. The growth is fueled by semiconductor architecture increasing complexity - which requires greater accuracy around critical dimension measurements, overlay control and defect detection. With EUV penetration, the importance of in-line metrology systems is critical to improving yield loss and maintain consistency in manufacturing. AI-based analytics and automation are also driving adoption in metrology tools, while making the process control faster for chipmakers to take their next-gen chips to market.
   
• Also, there are new advances in scatterometry, hybrid metrology and high-resolution e-beam inspection that are broadening the capabilities of EUV metrology tools are now indispensable for optimizing processes in FinFET and Gate-all-around (GAA) transistors. Regulatory collaboration with international standards, like SEMI E10 and ISO 9001 for validating performance consistently. The segment growth is further driven by greater investment into R&D labs and pilot fabs in the Asia-Pacific and U.S. were reducing defect density & lowering accuracy to sub-nanometer is mission-critical for progressing lithography nodes.

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On the basis of equipment type, the extreme ultraviolet lithography market has been divided into scanner equipment, mask inspection equipment, pellicles and reticle handling, and track systems (coater/developer). The scanner equipment sector holds the largest market share of 38.1%.
 

• The scanner equipment segment had a market value of USD 4.3 billion in 2024, making it the largest portion of the EUV lithography market as it performs an essential function when fabricating advanced semiconductors at sub-7nm nodes. The rising demand for high-performance computing, particularly AI chips with the need for incredibly precise & complex transistor patterns, along with 5G-enabled devices, is driving widespread adoption of these scanners by integrated device manufacturers & foundries.
   
• In addition, continuous enhancements in scanner throughput, light source power, and lens design are making production more productive and less expensive per wafer. Major suppliers are also incorporating actinic inspection and in-line metrology equipment directly on scanners to increase pattern accuracy and defect control capabilities essential for the high precision required in AI chip manufacturing and other advanced semiconductor applications.
   
• The mask inspection segment is the highest growing segment and is expected to grow at a CAGR of 13% during the forecast period. The segment's growth is boosted by the growing defect sensitivity and complexity of EUV photomasks, necessitating high-resolution inspection systems capable of ensuring pattern accuracy and reducing yield loss. With the technological developments in semiconductors towards multi-patterned chips and intricate systems-on-chip designs, the need for accurate mask inspection technologies increases. These trends altogether accelerate the use of advanced inspection tools, hence rendering this segment a key driver to overall market growth.
   
• In addition, High-NA EUV technology is creating demand for next-generation mask inspection equipment with phase-shift defect detection & absorber edge placement error detection at nanometer accuracy. Industry leaders are investing in e-beam-based inspection technologies and machine learning-based defect classification to meet the increasing complexity and quantity of EUV reticles.
   

Based on technology node, the extreme ultraviolet lithography market is segmented into 7nm, 5nm and 3nm. The 7nm segment holds the largest market share of 40.3% and is also forecasted to grow at a CAGR of 8.1% during the forecast period.
 

• The 7nm segment was the leader in the Extreme Ultraviolet (EUV) Lithography market in 2024, as it reached an evaluation of USD 4.6 billion. The 7nm node has led more powerful and energy-efficient chips particularly in high performance computing and flagship smartphone SOCs. The need for new chips on the 7nm node is driven by the need to increase transistor density and performance while also minimizing power consumption which is essential in advanced CPUs, GPUs, and AI accelerators. The global expansion of cloud computing, 5G, and edge AI has supported an ongoing demand for chips manufactured on the 7nm node. Leading foundries like TSMC and Samsung have increased EUV-based 7nm processes to support high-volume production across multiple industries.
   
• The 7nm segment is forecasted to grow at a CAGR of 8.2% through the forecast period. Introducing EUV lithography at the 7nm node simplified the increase in multi-patterning complexity resulting in reduced mask counts, design cycle time, and production costs. Furthermore, automotive electronics demand especially for ADAS and infotainment, increasingly require 7nm-level performance continuing to encourage uptake beyond that of consumer tech. As chip designers continue to optimize for power, performance, and area (PPA), the 7nm EUV node remains a strategic inflection point acting as a bridge between mature FinFET technologies and emerging gate-all-around (GAA) transistor designs.
   
• The 5nm segment appears to be one of the fastest growing segments of the EUV lithography market & is estimated to grow at a CAGR of 8.9%. This growth is primarily driven by the increasing demand for high-density, energy-efficient integrated circuits used in advanced applications such as 5G baseband chips, high-performance GPUs, AI accelerators, and data center processors. Semiconductor companies are accelerating their move to 5nm nodes to meet requirements for lower power consumption and higher transistor density, especially for mobile computing and cloud infrastructure. In addition, the growing use of advanced driver assistance systems (ADAS), edge AI devices, & quantum computing accelerators is driving the need for small, high-performance chips.
   
• EUV lithography offers pivotal advantages which will support sustained growth within this market with more repeated accuracy in patterning, improved resolution, fewer total multi-patterning steps, and improved yield and throughput. Technological advances such as DTCO (design technology co-optimization), developments in photoresists, and collaborations between EDA (Electronic Design Automation) vendors, tool suppliers and Foundries have enabled rapid cycles from design to process enabling commercialization and growth opportunity in the 5nm area.
   

On the basis of end use, the extreme ultraviolet lithography market is segmented into integrated device manufacturers and foundries. The foundries segment accounts for the highest market share of 68.7%.
 

• The foundries segment was a major contributor to the Extreme Ultraviolet (EUV) Lithography market in 2024, with a valuation of USD 7.8 billion. Foundries are rising their emphasis on EUV lithography to ensure leadership in technologically advanced node development. Leading companies like TSMC & Samsung are making investments in extending their EUV-compatible fabs to address the complex multi-patterning requirements & increased resolution required for generation semiconductors. EUV lithography plays a key role in lowering mask count and number of process steps to deliver superior cost efficiency, while contributing to improved yield. Further, the demand for chip design that is driven by AI (artificial intelligence) and custom silicon for hyperscalers is set to amplify demand for flexibility and scalability within foundry operations for EUV solutions.
   
• The growing proliferation of chiplet-based architectures and multi-layer 3D stacking technology is also increasing the importance of EUV as foundries adopt this advanced packaging method. These methods require finer interconnect geometries and high precision alignment of layers, where EUV has the overlay control, and resolution to satisfy these performance specifications. Foundries are able to leverage EUV for enabling high-density interposers and hybrid bonding processes, critical for optimizing performance-per-watt for HPC and AI processors. These advancements align with the future paradigms for scaling semiconductors, which will translate to greater capital investment into EUV systems.
   
• The integrated device manufacturers segment is steadily advancing in the Extreme Ultraviolet (EUV) Lithography industry and will grow at a CAGR of 9.0% during the forecast period. Integrated device manufacturers (IDMs) are beginning to adopt EUV lithography to use within their proprietary manufacturing, and operate under their own in-house manufacturing processes, driven by the desire to maintain the controls relevant to design-to-fab cycles. IDMs are especially applicable in markets like aerospace, defense, and industrial automation where security, customization, and high-performance chips are required. By relying on EUV-enabled pattern fidelity & smaller features, IDMs can offer higher transistor density chips & thus improved processing speed and energy consumption. Also, IDMs have entered collaborations with equipment vendors to co-develop EUV-compatible process flows which enables faster adoption of EUV lithography and allowed them to implement this into their proprietary manufacturing lines. This provides IDMs an important role in the high-performance computing, and edge AI chip markets.
   
• For IDMs, the increased focus on co-optimizing hardware and software for end-use applications is helping to push contention of EUV lithography use. Since IDMs cover both chip design and the subsequent fabrication, they will have the ability to leverage key device performance features based on EUV, like backside power delivery and logic scaling.

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In 2024, North America held a 26.7% share of the global extreme ultraviolet lithography market, valued at USD 3 billion, & is expected to continue to show stability in growth. The region continues to experience steady growth due to a mature semiconductor manufacturing ecosystem, rapid digitalization across industries, and growing demand for ultrafine patterning technology that will drive the next-generation chips. The region's desire for technological sovereignty, the growth of AI and high-performance computing (HPC) infrastructure, and the implementation of EUV lithography for the development of advanced packaging and logic nodes are among the key accelerators of regional growth.
 

• The U.S. extreme ultraviolet (EUV) lithography market was valued at USD 2.8 billion in 2024, capturing most of the regional share. The current semiconductor design superiority in the nation, along with the CHIPS & Science Act, involving extensive resources in U.S.-based chip manufacturing, will alter the domestic supply chain with the establishment of U.S. fabrication capacity.
   
• Increased demands from sectors including autonomous vehicles, consumer electronics, and aerospace defense have led to investments in chip manufacturing at sub-5nm nodes, contributing to the increased use of EUV lithography.
   
• In addition, growing adoption of edge computing, AI-chip, and IoT device deployments emphasizes the need for highly accurate, high-throughput patterning solutions, which is creating a sustained wave of momentum for EUV tool suppliers.
   
• The competition within the U.S. extreme ultraviolet lithography market is strengthening as domestic fabs are increasingly working with the EUV tool vendors in order to scale manufacturing processes and lower defectivity at advanced nodes. Leading foundries are adopting EUV-based multi-patterning approaches to production for nodes below 5nm, and this is driving demand for specific pellicles, resist materials, and inspection tools.
   
• The interest from the U.S. defense side in hardened semiconductors for radiation applications is also opening up niche EUV applications in aerospace-grade electronics. These vertical-specific requirements are leading equipment manufacturers to also look at localized support infrastructure and talent development, to help drive adoption of EUV to meet specific U.S. industry performance requirements.
   
• The Canada EUV lithography market reached a value of USD 251.6 million in 2024 and is anticipated to increase consistently during the forecast period. Canada's momentum continues to be powered by increased investments in quantum computing and advanced photonics, and the ramp up of domestic chip prototyping activity.
   
• The clean energy transition, smart manufacturing, and growing interests in microelectronics for health and telecom are additionally elevating demand for lithography equipment. In turn, academic and industry partnerships and funding in nanotechnology R&D will drive innovation pipelines, in which EUV lithography tools facilitate the development of energy-efficient, low carbon credentials in semiconductors and sensors.
   
• Canada's participation in the EUV lithography value chain is slowly gaining traction as it provides value in materials innovations and metrology solutions. Government-backed programs are encouraging partnerships between Canadian startups and global lithography leaders to co-develop EUV-compatible photoresists and optical components.
   
• Moreover, Canada’s national strategy to develop advanced packaging capabilities aligns with the need for EUV lithography in 3D IC and chiplet architectures. As the country strengthens its position in photonics and optoelectronics, its role as a supplier of enabling technologies for EUV equipment manufacturing is likely to grow, positioning Canada as a niche but strategic contributor in the global ecosystem.
   
• Canada is growing slowly in the EUV lithography value chain focusing on materials innovation and metrology solutions. Government funded initiatives are stimulating collaborations between Canadian startups and major global lithography suppliers to co-develop materials such as EUV-compatible photoresists and optical components.
   
• Furthermore, Canada’s own national initiative to develop advanced packaging capabilities is outlining a role for EUV lithography - whereby 3D ICs and chiplets will require EUV lithography. As the company works toward building capacity in the photonics/ optoelectronics space, it is very likely that Canada will continue to play a role as a supplier of enabling technologies for manufacturers of EUV equipment. Canada’s role may be niche but strategic in the overall ecosystem.
   

Europe held a 21.3% share of the global extreme ultraviolet lithography market in 2024 and is growing at a CAGR of 10.4%, Europe’s strategic emphasis on semiconductor sovereignty, underpinned by initiatives like the EU Chips Act and Horizon Europe, is expected to catalyze the growth of the EUV lithography market across the region.
 

• By 2024, the Germany Extreme Ultraviolet (EUV) Lithography Market was valued at USD 923.2 million, expected growth with a CAGR of 9.9% through the forecasted years. Germany is critical to the EUV lithography supply chain due to its position at the nexus of precision engineering and the emerging field of photonics research. Specifically, Germany can provide tools, technologies, and methodologies in advanced optics, light sources, and more recently, resist materials for EUV processing.
   
• Emerging firms are actively partnering with leading semiconductor equipment firms on the global stage to furnish EUV subcomponents, and to integrate systems required for EUV tools, particularly for below 7nm production. German state-backed initiatives like “IPCEI Microelectronics” are helping to stimulate an indigenous EUV incursion into the overall EUV infrastructure and capabilities of local Foundries and IDMs.
   
• Therefore, while organizations are innovating at the leading edge of developments in quantum computing and AI hardware, the demand for ultra-fine lithography nodes will undoubtedly grow, with Germany keeping its position as a high-tech EUV adopter.
   
• The UK extreme ultraviolet (EUV) lithography market was valued at USD 152.4 million in 2024 and is projected to grow steadily during the forecast period. The UK is gradually scaling its participation in the EUV lithography market through its emerging semiconductor fabrication ecosystem and material science research hubs.
   
• With recent public and private investments directed at building resilient supply chains and fostering chip design innovation, the country is becoming a niche player in EUV-supporting technologies such as advanced resists, etching chemistries, and thermal management systems.
   
• The UK government-backed semiconductor strategy is improving the EUV lithography market indirectly, as it is increasing demand for advanced prototypes for domestic chip design and R&D. While UK fabless companies are advancing in design, using smaller process nodes through EUV for AI, 5G, and defense electronics, partnerships with foundries that are EUV-enabled in various parts of Europe and Asia are becoming critical. There are also research clusters for specific domains in the UK that have a value stream in EUV-related areas, like EUV metrology, beamline simulations, and defect identification. Institutes like Rutherford Appleton Laboratory and the University of Southampton are currently researching photonics related to nanofabrication and laser plasma sources, complementing the nature of EUV lithography systems.
   
• These activities have competencies being funded by UKRI and private stakeholders, preparing the UK as a specialized contributor to the global EUV lithography ecosystem entering into next-gen tool calibration and process optimization domains.
   

In 2024, the Asia-Pacific region had the highest share of the extreme ultraviolet lithography market in terms of market value as well, at USD 5 billion. The strength of the region in this arena is also buoyed by large investment from leading companies, such as TSMC, Samsung, and Intel (in their foundry expansion). In addition, Asian countries have identified EUV lithography as a critical technology required to manufacture 5nm and sub-5nm chips, so we can expect to see increased demand for high-end photomasks, photoresists, and optics.
 

• China EUV lithography market is forecasted to reach USD 1.3 billion in 2024. Economic & military tensions have made self-sufficiency in semiconductor manufacturing an obligation for China. While Chinese firms are stilled challenged by leading EUV machine suppliers in the West, China is exploring opportunities for self-reliance by investing in DUV lithography & building their own EUV machines.
   
• Large national funding initiatives such as the Big Fund are introducing capital and other resources into China’s EUV-related research and development, particularly with respect to optics, resists, and metrology-based components.
   
• At the same time, China is fostering a vigorous environment for supporting the evolving ecosystem around EUV infrastructure, namely, cleanroom automation, vibration control, and wafer handling with high precision.
   
• Collaborative R&D programs between state research institutes and corporations are paving the way for advances in mask defect detection and beam source technologies, putting China in a position for long-term sustainability in sub-7nm process development, even with some limitations in import availability in the short term.
   
• The Japan extreme ultraviolet lithography market size was valued at USD 1.5 billion in 2024. Japan has a vital position in the EUV lithography supply chain in many areas including materials and subcomponents. Important suppliers to the EUV market include Tokyo Electron, JSR and Nikon, which provide photoresists, pellicles, and metrology tools essential for EUV success.
   
• With EUV lithography demand for 5nm and 3nm nodes increasing, Japan is expanding domestic capacity and ramping up R&D on materials designed specifically for EUV processes with support from the government.
   
• Furthermore, Japan is rapidly accelerating access to the EUV innovation potential by collaborating with the U.S. and other Western nations to co-develop next generation semiconductor technologies.
   
• These partnerships with the likes of ASML and TSMC, including TSMC's new fab in Kumamoto, are enabling critical technology transfer, and building domestic knowledge and capability to implement EUV, helping to build market resilience for the long term.
   
• The India extreme ultraviolet lithography market is reported to be worth USD 190 million in 2024 for India as part of the country’s semiconductor roadmap which also calls for EUV enabled fabs through government incentives and policy changes through the Semicon India program.
   
• India is trying to carve out a niche as a high-value location for chip packaging and has established initial discussions with global chipmakers to establish sub-10nm capable logic manufacturing shorts. As such, the EUV lithography market in India is tied to the future establishment of cutting-edge fab infrastructure.
   
• In addition, India has its eyes on creating a robust ancillary ecosystem and has subsidized the development of EUV related support industries like ultra-pure chemicals, photomask blank making, and vacuum optics.
   
• These capabilities have been buoyed by public-private partnerships and research activities with institutions such as IISc and IITs, to organically develop a slice of the global EUV supply chain.
   
• India is pursuing international tech transfer agreements as well as workforce development programs in areas requiring EUV skills such as tool maintenance, calibration, and beamline diagnostics.
   
• This multifaceted approach supports India's ambition to be more than simply the host rides to EUV fabs, but to engage on a larger scale within the global innovative community around state-of-the-art lithography.
   

Latin America accounted for a 3.5% share of the global extreme ultraviolet lithography market in 2024, growing at a 9.8% CAGR. Growth factors are strong interest in domestic semiconductor packaging opportunities, rapidly growing demand for more advanced imported chips, & strong policy momentum surrounding digital transformation. Brazil & Mexico are quickly developing semiconductor testing & validation centers while also establishing electronics R&D centres that could potentially serve as a foundation for future EUV infrastructure. Partnerships with North American semiconductor companies and targeted workforce development for nanofabrication and process engineering disciplines are slowly improving the regional readiness to adopt advanced lithography technologies within the next decade.
 

The Middle East & Africa extreme ultraviolet lithography market was valued at USD 468.4 million in 2024. Fueled by growing strategic interest in semiconductor sovereignty, digital manufacturing, and space-related technologies. Several nations in the region are exploring the integration of EUV-compatible systems in emerging fabrication and prototyping labs, particularly as part of sovereign tech and electronics localization programs. Furthermore, access to oil-funded innovation funds in Gulf countries & increasing participation in international semiconductor alliances are setting the stage for MEA countries to act as satellite hubs for testing and small-scale lithographic processing in specialized verticals like aerospace, automotive electronics, and defense.
 

• In 2024, the South Africa Extreme Ultraviolet (EUV) Lithography market reached a value of USD 85.9 million, supported by a strategic focus on industrial automation, localized electronics prototyping, & power electronics innovation. The country's national push to digitalize critical infrastructure such as smart grids, telecom base stations, & rail systems depends on chips manufactured using high-precision lithography.
   
• South Africa's investment in advanced microelectronics laboratories using academic institutions and R&D state-owned centers is creating a demand for EUV-compatible support equipment such as inspection systems and measurements metrology units and resist test systems.
   
• These labs have the even larger role in retraining a highly skilled labor force and conducting research into nanoimprint lithography and improved mask prep- which are processes that would be indirectly pushing a state of readiness to adopt EUV lithography in the longer term. The country is now starting to establish itself as a southern hemisphere hub for innovation in precision fabrication and microscale chip design support, creating an emerging point of interest for EUV-related pilot deployments.
   
• The UAE extreme ultraviolet lithography market was worth USD 149.4 million in 2024 and is creating a regional innovation node for adopting high-end semiconductor technologies. The UAE is also establishing bilateral research agreements with the U.S., Japan, and South Korea to facilitate knowledge transfer in EUV material science, mask handling, and vacuum optics.
   
• Dubai and Abu Dhabi’s tech free zones now host several R&D centers working on 3D IC packaging, photonics, and advanced wafer bonding all of which are downstream users of EUV-fabricated chips. With its favorable regulatory environment, advanced logistics, and energy-efficient data centers, the UAE is steadily transforming into a staging ground for EUV-aligned R&D and design validation platforms in the wider MENA region.
   
• In 2024, the extreme ultraviolet lithography market in the Rest of MEA reached USD 68.6 million, with growing regional interest in advanced electronics production and cross-border semiconductor collaborations.
   
• Countries like Egypt, Morocco, and Nigeria are prioritizing semiconductor capacity-building through international training programs, tech parks, and public–private partnerships that promote microfabrication capabilities. Newly established digital hubs in North Africa are examining EUV-aligned pilot lines for nanoscale imaging, lithography research, and photomask testing in academic-industrial collaborations.
   
• Regional decentralization of electronics manufacturing as part of economic transformation plans such as Egypt Vision 2030 and Morocco's Industrial Acceleration Plan is creating the foundation to pursue future EUV-compatible facilities. As governments invest in component design labs and cleanroom certification programs, there is increasing potential for EUV lithography market players to introduce modular research-grade systems, especially for sub-10nm process learning, academic prototyping, and advanced materials evaluation. Vendors offering affordable, scalable EUV ecosystem solutions can find first-mover advantages by aligning with local capacity-building and skill development missions.
   

Extreme Ultraviolet Lithography Market Share

• The EUV lithography market is a highly competitive market with many big and small companies within the markets ASML, TRUMPF, AGC Inc., Carl Zeiss AG and TOPPAN Holdings Inc. are the key players in the general aviation market. These companies collectively accounted for 60.7% of the total market share in 2024.
   
• ASML is a prominent supplier in the extreme ultraviolet (EUV) lithography market, taking up approximately 49.8% of the overall market share. ASML also offers high-performance, handheld and benchtop Extreme Ultraviolet (EUV) Lithography, already in growing use for automotive electronics and power electronics testing. Hioki's continued advancements have them in a competitive position with moisture- and heat-resistant designs, easy user-friendly interfaces, and localized calibration services. Sustainability, process accuracy, regionalization, and a strong local supply chain are focal points in competition.
   
• TRUMPF has a market share of 3.3% with an affordable cost structure, compact features, and environmental performance in their extreme ultraviolet (EUV) lithography. They demonstrate substantial value with durability in use, precision in component retention, and portable test solutions that promote use in education, telecom testing, and field testing. The company's focus on user interface, quality in product design, and a commitment to creating sustainable products improves the possibility of competing on a global level.
   
• AGC Inc. has a market share of 3% with an established automated test platform and high precision metrology solutions. Chroma continues to support advanced applications in testing in semiconductors and EV batteries applications and aerospace applications.
   
• Carl Zeiss AG has a market share of around 3.75%, leveraging its expertise in high-precision optics and photonics. The company delivers substantial value through advanced EUV mirrors, lens systems, and imaging technologies that ensure superior resolution and throughput. Its innovations in optical metrology and precision engineering strengthen EUV system performance, supporting sub-2nm node development. With strong R&D capabilities, collaborative partnerships with ASML, and a focus on sustainable optical solutions, Carl Zeiss enhances competitiveness and reinforces its leadership position in global semiconductor manufacturing.
   
• TOPPAN Holdings Inc. holds a market share of approximately 0.74%, driven by its advanced photomask technologies in EUV lithography. The company provides significant value with high-quality EUV mask blanks, defect management solutions, and precision in pattern fidelity. Its expertise ensures greater reliability and efficiency in next-generation semiconductor production, meeting rising industry demands. By investing in research on defect-free masks, enhancing manufacturing scalability, and pursuing eco-conscious processes, TOPPAN strengthens its role as a critical enabler of EUV adoption across global semiconductor supply chains.
   

Extreme Ultraviolet Lithography Market Companies

Some of the prominent market participants operating in the industry include:
 

• ASML
• TRUMPF
• TOPPAN Holdings Inc.
• AGC Inc.
• Carl Zeiss AG
• NTT Advanced Technology Corporation
• ADVANTEST CORPORATION
• Ushio Inc.
• SUSS MicroTec SE
• Lasertec Corporation
• Energetiq Technology, Inc.
• NuFlare Technology Inc.
• Photronics, Inc.
• HOYA Corporation
• Nikon Corporation
   
• Carl Zeiss AG is an established technological innovator and market player in the EUV lithography optics and metrology segment. The company's core competency is based on high-tech optical systems, precision lens manufacturing, and high-resolution mask inspection solutions all important to EUV lithography capability. Carl Zeiss's USP is its unmatched skill set in ultra-exact optical components that are capable of providing ideal imaging quality for sub-7nm node fabrication. Close partnerships with most major semiconductor manufacturers and its ability to innovate, continuously develop and release state-of-the-art nano-scale metrology systems enhances its position as a leader in support of integrated EUV lithography work systems. Strong R&D capabilities and its commitment to sustainability only improves its attractiveness to next-generation semiconductor fabrication fabs.
   
• TOPPAN Holdings Inc. is becoming an established specialist player in EUV mask manufacturing and reticle handling technologies both important components of the lithography value chain. The USP of TOPPAN Holdings is focused on proprietary ultra-clean mask manufacturing processes and its new pellicle development. Each of these technologies represents significant intention and use to improve yield and defect control in EUV activities. TOPPAN Holdings is now a complete solution provider with processes starting in mask blank manufacturing and finishing with reticle inspection capabilities allowing it as a trusted supplier to foundries supporting semiconductor customers in high-volume manufacturing settings.
   
• Energetiq Technology, Inc. is a specialized developer and manufacturer of ultra-bright broadband light sources, including EUV sources, essential for semiconductor metrology and inspection. The company's core competency lies in its Electrodeless Z-Pinch and Laser-Driven Light Source technologies, which provide high brightness and stability for applications like actinic mask inspection and resist metrology. Energetiq's unique selling proposition (USP) is its ability to deliver compact, modular EUV light sources, such as the EQ-10R and EQ-10HP, that minimize heat load and reduce debris, making them ideal for integration into advanced semiconductor equipment. With a strong focus on research and development, Energetiq collaborates closely with industry leaders to advance EUV technology, positioning itself as a key enabler in the transition to sub-2nm nodes. Its commitment to innovation and quality enhances its attractiveness to next-generation semiconductor fabrication facilities.
   
• NuFlare Technology Inc. is a leading provider of mask writing and inspection equipment, playing a critical role in the EUV lithography value chain. The company's core competency is in the development and manufacture of advanced electron beam (e-beam) mask writers and high-resolution mask inspection systems. NuFlare's USP is its multi-beam mask writer technology, exemplified by the MBM-4000, which offers high-speed, high-accuracy patterning for EUV masks, essential for high-NA EUV lithography. The company's mask inspection systems, such as the NPI-8000, provide rapid and sensitive detection of defects in photomasks, ensuring the quality and yield of semiconductor devices. NuFlare's focus on precision and innovation, combined with its strategic partnerships with major semiconductor manufacturers, solidifies its position as a trusted supplier in the EUV lithography market.
   
• Photronics, Inc. is a global leader in photomask technology, providing critical solutions for advanced semiconductor manufacturing, including EUV lithography. The company's core competency is in the design and production of photomasks that enable the transfer of circuit patterns onto semiconductor wafers. Photronics' USP is its extensive experience and capability in producing high-quality photomasks for nodes at 7nm and below, including 5nm and 2nm EUV applications. The company's advanced photomask offerings include binary masks, phase-shift masks, and multi-patterning solutions, which are essential for the fabrication of complex semiconductor devices. Photronics' strategic alliances, such as its partnership with IBM Research, enhance its R&D capabilities, enabling the development of next-generation EUV photomask technologies. Its global manufacturing footprint and commitment to innovation position Photronics as a key player in the EUV lithography market, supporting the industry's move towards smaller and more powerful semiconductor devices.
   

Extreme Ultraviolet Lithography Industry News

• In October 2024, Energetiq’s first extreme ultraviolet (EUV) light source, the EQ-10M introduced nearly two decades ago continues to support vital research at the University at Albany. Its patented Electrodeless Z-Pinch technology reliably generates 13.5 nm EUV photons, enabling advancements in photoresist development and semiconductor miniaturization. Despite minor maintenance, strong collaboration between Energetiq and the university ensures ongoing success, with the newer EQ-10R model secured as a backup to sustain future EUV lithography research.
   
• In March 2024, Nikon is strategically focused on China’s booming new energy vehicle (NEV) industry by supplying lithography equipment to leading Chinese EV manufacturers. Unlike its main competitor ASML, which concentrates on advanced lithography machines, Nikon offers a diversified product portfolio including lithography inspection tools. In 2024, Nikon plans to emphasize the Chinese market with new machines like the NSR-2205iL1, designed for etching silicon carbide (SiC) wafers, addressing growing demand for 28nm process chips in power, storage, and logic applications.
   

The extreme ultraviolet lithography market research report includes in-depth coverage of the industry with estimates and forecasts in terms of revenue in (USD million) from 2021 – 2034 for the following segments:

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Market, By Component

• Light Source
• EUV Mask
• EUV Optics
• Metrology Equipment
• Others

Market, By Equipment Type

• Scanner equipment
• Mask inspection equipment
• Pellicles and reticle handling
• Track systems (coater/developer)

Market, By Technology Node

• 7nm
• 5nm
• 3nm

Market, By End Use Industry Type

• Integrated device manufacturers
• Foundries

The above information is provided for the following regions and countries: 

• North America 
  • U.S.
  • Canada 
• Europe
  • Germany
  • UK
  • France
  • Spain
  • Italy
  • Netherlands 
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea 
• Latin America
  • Brazil
  • Mexico
  • Argentina 
• Middle East and Africa
  • Saudi Arabia
  • South Africa
  • UAE