FinFET 3D Transistors Market size is expected to grow over the forecast timespan driven by a rise in the demand for these components in consumer electronics. FinFET technology is a non-planar & double-gate transistor based on a conducting-channel above the insulator level, which forms a fin-shaped silicon structure. These components offer low current leakage and improve the performance of devices. This type of multi-gate process extends Moore’s law, which allows semiconductor manufacturers to create CPUs and memory modules that consume less energy.
The rising demand for miniaturized semiconductors and increasing performance from end-user industries are the key factors fueling the market growth. Technological advancements in semiconductors are driving enhanced performance, reduction in cost, and achieving greater reliability, leading to the demand for efficient transistors with reduced channel-length. FinFETS has better electrostatic integrity than normal CMOS and MOSFETS due to its dual-gate structure and help in improving the application processors of high-end smartphones, laptops, and tablets.
Design-related complexities associated with FinFET 3D transistors are restraining the market expansion. These transistors have a low life-cycle and are difficult to modify after their fabrication. In addition, self-heating issues led by the compact assembly of 3D transistors are further hampering the market value.
The Graphics Processing Unit (GPU) in the FinFET 3D transistors market is witnessing high growth till 2027 impelled by increasing demand from AR/VR applications. The integration of GPUs has improved the performance of virtual reality and augmented reality by optimizing power efficiency, boosting the market revenue. The rising demand for FPGAs across numerous applications will create opportunities for these components in the coming years. The growing requirements for high specification in gadgets such as streaming videos with less buffering, multimedia, fast charging, and video & camera support have enabled tech giants to invest more into GPU cores and next-generation FinFET technology, propelling the market size.
The 7nm process technology segment is observing an increasing adoption in emerging applications such as 5G and AI chipsets. FinFET 3D transistors based on 7nm process technology offer several intuitive features such as high-performance, energy efficiency, and a smaller footprint compared to other process nodes. Adding to this, growing uptake of 7nm chipsets in 5G terminal devices will further spur the market growth. According to the GSMA Mobile Economy 2020 report, the total number of global 5G connections is projected to cross the 1.8 billion mark by 2025. The proliferation of 5G connections will add new growth opportunities to the segment growth.
North America FinFET 3D transistors market will showcase substantial growth from 2021 to 2027 on account of favorable government initiatives supporting the regional semiconductor manufacturing industry. The presence of various tech giants, such as Qualcomm, Xilinx, GlobalFoundries, and Intel Corporation, in the region is creating high growth opportunities to increase the working capacity of semiconductor manufacturing. The proliferation of AI and IoT devices in the region will further contribute to the market expansion.
Key players operating in the market are Samsung Electronics Corporation Ltd., Taiwan Semiconductor Manufacturing Company Limited, United Microelectronics Corporation, GlobalFoundries, Inc., Qualcomm Technologies, Inc., Intel Corporation, Xilinx, Inc., MediaTek, Inc., Arm Holdings PLC, Semiconductor Manufacturing International Corporation, Huawei Technologies Co., Ltd., Broadcom, Inc., NVIDIA Corporation, Advanced Micro Devices, Inc., and others. The key companies focus on continuous research & development activities to provide more advanced products than their competitors.
Market, By Product
Market, By Technology
Market, By Application
The above information has been provided for the following regions and countries: