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Interposer and Fan-out WLP Market Trends

  • Report ID: GMI8177
  • Published Date: Feb 2024
  • Report Format: PDF

Interposer and Fan-out WLP Market Trends

The growing demand for miniaturization and increased integration density in electronic devices is augmenting the use of advanced packaging solutions. Interposer and fan-out WLP technologies allow for the integration of multiple chips into a small form factor, meeting the needs of compact, more powerful devices. The proliferation of smartphones, wearables, IoT devices, and other electronics with advanced capabilities spurs the demand for interposer and fan-out WLP solutions. These technologies provide improved performance, reliability, and power efficiency, meeting the changing needs of consumers and industries. For instance, in October 2023, Advanced Semiconductor Engineering, Inc. (ASE) introduced the Integrated Design Ecosystem (IDE), a collaborative design toolset designed to systematically enhance advanced package architecture throughout its VIPack platform. This innovative approach allows a seamless transition from single-die SoC to multi-die disaggregated IP blocks including chiplets and memory for integration using 2.5D or advanced fanout structures.

The rising complexities of semiconductor designs and the growing demand for heterogeneous integration will propel market growth. Interposer and fan-out WLP technologies allow for the integration of various types of chips, such as logic, memory, and sensors, into a single package, resulting in seamless connectivity and enhanced functionality. Overall, the interposer and fan-out WLP industry is expected to grow further due to the surging demand for advanced packaging solutions across a wide range of industries and applications.

Authors: Suraj Gujar , Sandeep Ugale

Frequently Asked Questions (FAQ) :

Interposer and fan-out wafer-level packaging (FOWLP) industry accounted for more than USD 30 billion in 2023 and is set to expand at over 12% CAGR between 2024 and 2032 driven by the increasing use of advanced packaging solutions in wearables and smartphones.

The fan-out WLP (FOWLP) segment in the interposer and fan-out WLP industry is anticipated to witness over 13% CAGR during 2024-2032 as they offer numerous advantages over traditional packaging methods, including improved electrical performance, higher integration density, and better thermal management.

North America held more than 30% revenue share of the interposer and fan-out WLP market in 2023 and is estimated to exhibit robust growth through 2032 owing to the presence of many leading semiconductor companies, research institutions, and technology hubs in the region.

Some of the top firms engaged in the interposer and fan-out WLP industry are ALLVIA, Inc., AMETEK Inc., ASE Technology Holding Co., Ltd., ASTI Holdings Limited, Broadcom, Infineon Technologies AG, Intel Corporation, LAM RESEARCH CORPORATION, Murata Manufacturing Co., Ltd., Powertech Technology Inc., Qualcomm Technologies, Inc., SAMSUNG, STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited, and TOSHIBA CORPORATION, among others.

Interposer and Fan-out WLP Market Scope

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Premium Report Details

  • Base Year: 2023
  • Companies covered: 19
  • Tables & Figures: 355
  • Countries covered: 22
  • Pages: 250
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