Report Content
Chapter 1 Methodology & Scope
1.1 Market scope & definitions
1.2 Base estimates & calculations
1.3 Forecast calculations
1.4 Data sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Industry 360-degree synopsis, 2018 - 2032
Chapter 3 Industry Insights
3.1 Industry ecosystem analysis
3.2 Profit margin analysis
3.3 Technology & innovation landscape
3.4 Patent analysis
3.5 Key news & initiatives
3.6 Regulatory landscape
3.7 Impact forces
3.7.1 Growth drivers
3.7.1.1 Increasing demand for miniaturization in electronic devices drives growth
3.7.1.2 Growing adoption of advanced packaging solutions in smartphones and wearables
3.7.1.3 Increasing complexity of semiconductor designs boosts demand for interposer and fan-out WLP
3.7.1.4 Increasing use in data centers for improved performance and power efficiency
3.7.1.5. Growing focus on 5 G technology stimulates demand for advanced packaging solutions
3.7.2 Industry pitfalls & challenges
3.7.2.1 Thermal management
3.7.2.2 Standards and compatibility challenges
3.8 Growth potential analysis
3.9 Porter’s analysis
3.9.1 Supplier power
3.9.2 Buyer power
3.9.3 Threat of new entrants
3.9.4 Threat of substitutes
3.9.5 Industry rivalry
3.10 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Packaging Component, 2018 - 2032 (USD Million)
5.1 Key trends
5.2 Interposer
5.3 FOWLP
Chapter 6 Market Estimates & Forecast, By Application, 2018 - 2032 (USD Million)
6.1 Key trends
6.2 MEMS or sensors
6.3 Imaging & optoelectronics
6.4 Memory
6.5 Logic ICs
6.6 LEDs
6.7 Others
Chapter 7 Market Estimates & Forecast, By Packaging Type, 2018 - 2032 (USD Million)
7.1 Key trends
7.2 2.5D
7.3 3D
Chapter 8 Market Estimates & Forecast, By End-User, 2018 - 2032 (USD Million)
8.1 Key trends
8.2 Consumer electronics
8.3 Automotive
8.4 Industrial sector
8.5 Telecommunications
8.6 Military & aerospace
8.7 Others
Chapter 9 Market Estimates & Forecast, By Region, 2018 - 2032 (USD Million)
9.1 Key trends
9.2 North America
9.2.1 U.S.
9.2.2 Canada
9.3 Europe
9.3.1 UK
9.3.2 Germany
9.3.3 France
9.3.4 Italy
9.3.5 Spain
9.3.6 Russia
9.3.7 Rest of Europe
9.4 Asia Pacific
9.4.1 China
9.4.2 India
9.4.3 Japan
9.4.4 South Korea
9.4.5 ANZ
9.4.6 Rest of Asia Pacific
9.5 Latin America
9.5.1 Brazil
9.5.2 Mexico
9.5.3 Rest of Latin America
9.6 MEA
9.6.1 UAE
9.6.2 Saudi Arabia
9.6.3 South Africa
9.6.4 Rest of MEA
Chapter 10 Company Profiles
10.1 ALLVIA, Inc.
10.2 AMETEK Inc.
10.3 Amkor Technology
10.4 ASE Technology Holding Co., Ltd.
10.5 ASTI Holdings Limited
10.6 Broadcom
10.7 Infineon Technologies AG
10.8 Intel Corporation
10.9 LAM RESEARCH CORPORATION
10.10 Murata Manufacturing Co., Ltd.
10.11 Powertech Technology Inc.
10.12 Qualcomm Technologies, Inc.
10.13 SAMSUNG
10.14 Siliconware Precision Industries Co.
10.15 STMicroelectronics
10.16 Taiwan Semiconductor Manufacturing Company Limited
10.17 Texas Instruments Incorporated
10.18 TOSHIBA CORPORATION
10.19 United Microelectronics Corporation
