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Interposer and Fan-out WLP Market Size

  • Report ID: GMI8177
  • Published Date: Feb 2024
  • Report Format: PDF

Interposer and Fan-out WLP Market Size

Interposer and Fan-Out Wafer-Level Packaging Market was valued at over USD 30 billion in 2023 and is estimated to register a CAGR of over 12% between 2024 & 2032.


Interposers serve as substrates facilitating advanced packaging, linking Integrated Circuits (ICs) with varied form factors or technologies for heterogeneous integration. Fan-out WLPs entail directly mounting and interconnecting ICs on a wafer, which boosts integration density and performance in compact configurations. Both techniques enhance device functionality and miniaturization in semiconductor packaging. The need for increased performance and power efficiency is driving the use of fan-out WLP and interposer technologies in data centers. Higher integration density, better signal integrity, and lower power consumption are made possible by these cutting-edge packaging solutions, making them ideal for high-performance computing applications in data centers, where performance and efficiency are essential for keeping up with the rising computational demands.

For instance, in November 2021, Samsung launched Hybrid-Substrate Cube (H-Cube) technology, a 2.5D packaging solution that applies silicon interposer technology and hybrid-substrate structure specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.

The need for interposer and fan-out WLP technologies is attributed to the increasing use of advanced packaging solutions in wearables and smartphones. These solutions meet the growing demand from consumers for more powerful, smaller devices with advanced features such as AI capabilities, high-resolution displays, and connectivity options. They also enable higher integration densities, improved performance, and enhanced functionality in compact form factors.

Thermal management is a significant challenge for the interposer and fan-out WLP market. As electronic devices become smaller and more powerful, managing heat dissipation becomes more complicated. Inadequate thermal management can result in reliability issues, performance degradation, and device failure, stifling market adoption as customers demand solutions that effectively address these challenges.

Authors: Suraj Gujar , Sandeep Ugale

Frequently Asked Questions (FAQ) :

Interposer and fan-out wafer-level packaging (FOWLP) industry accounted for more than USD 30 billion in 2023 and is set to expand at over 12% CAGR between 2024 and 2032 driven by the increasing use of advanced packaging solutions in wearables and smartphones.

The fan-out WLP (FOWLP) segment in the interposer and fan-out WLP industry is anticipated to witness over 13% CAGR during 2024-2032 as they offer numerous advantages over traditional packaging methods, including improved electrical performance, higher integration density, and better thermal management.

North America held more than 30% revenue share of the interposer and fan-out WLP market in 2023 and is estimated to exhibit robust growth through 2032 owing to the presence of many leading semiconductor companies, research institutions, and technology hubs in the region.

Some of the top firms engaged in the interposer and fan-out WLP industry are ALLVIA, Inc., AMETEK Inc., ASE Technology Holding Co., Ltd., ASTI Holdings Limited, Broadcom, Infineon Technologies AG, Intel Corporation, LAM RESEARCH CORPORATION, Murata Manufacturing Co., Ltd., Powertech Technology Inc., Qualcomm Technologies, Inc., SAMSUNG, STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited, and TOSHIBA CORPORATION, among others.

Interposer and Fan-out WLP Market Scope

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Premium Report Details

  • Base Year: 2023
  • Companies covered: 19
  • Tables & Figures: 355
  • Countries covered: 22
  • Pages: 250
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