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Advanced Packaging Market Analysis

  • Report ID: GMI4831
  • Published Date: Jan 2024
  • Report Format: PDF

Advanced Packaging Market Analysis

Based on packaging type, the market is segmented into flip-chip, fan-in wafer level packaging (WLP), embedded-die, fan-out, and 2.5 dimensional/3 dimensional. The flip-chip segment dominated the market in 2023 with a share of over 60%.

  • This packaging type offers shorter interconnection lengths, reducing signal delays & improving overall electrical performance, particularly crucial for high-speed and high frequency applications.
  • Flip-chip packaging facilitates a high number of input/output connections in a given area, offering increased connectivity. This is crucial for modern electronic devices, supporting the growing demand for complex functionalities and connectivity in applications such as high-performance computing, artificial intelligence, and Internet of Things (IoT) devices.
Advanced Packaging Market Share, By Application, 2023

Based on application, the market is divided into consumer electronics, automotive, industrial, healthcare, and aerospace & defense. The automotive segment is anticipated to register a CAGR of over 11% through 2032.

  • The shift toward electric vehicles (EVs) and hybrid cars has raised the demand for compact, efficient & high-performance advanced packaging solutions for power electronics and battery management systems.
  • The growing emphasis on connected vehicles and in-car infotainment systems necessitates advanced packaging for communication modules and integrated circuits, supporting the rising demand for smart & connected features in automobiles.
China Advanced Packaging Market Size, 2021-2032, (USD Billion)

Asia Pacific dominated the advanced packaging market with a share of over 65% in 2023. The region is expected to witness growth in the market owing to the presence of a strong electronics manufacturing ecosystem, rising demand for feature-rich & compact electronic gadgets, and a spike in the use of 5G technology. Asia Pacific is positioned as a major hub for advanced packaging due to its status as a global center of technology and the region's growing need for consumer electronics. The region's developing market and continuous technological progress create a favorable atmosphere for the development of sophisticated packaging solutions for a range of electronic uses.

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

Market size for advanced packaging crossed USD 30 billion in 2023 and is expected to register over 10% CAGR from 2024-2032 owing to an increasing trend of IoT and AI technologies worldwide.

The flip-chip packaging type segment held over 60% share advanced packaging industry in 2023 and is expected to register an appreciable CAGR from 2024-2032 owing to its ability to offer shorter interconnection lengths for reducing signal delays and improving overall electrical performance.

Asia Pacific held over 65% share of the advanced packaging industry in 2023 and is expected to register commendable CAGR from 2024-2032 due to the presence of a strong electronics manufacturing ecosystem in the region.

Amkor Technology, ASE Group, JCET Group Co., Ltd., Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, TongFu Microelectronics Co., Ltd., and UTAC are some of the major advanced packaging companies worldwide.

Advanced Packaging Market Scope

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Premium Report Details

  • Base Year: 2023
  • Companies covered: 16
  • Tables & Figures: 220
  • Countries covered: 21
  • Pages: 220
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