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Advanced Packaging Market Size

  • Report ID: GMI4831
  • Published Date: Jan 2024
  • Report Format: PDF

Advanced Packaging Market Size

Advanced Packaging Market was valued at over USD 34.5 billion in 2023 and is anticipated to grow at a CAGR of over 10% between 2024 & 2032. The increasing trend toward IoT and AI technologies globally drives growth in the advanced packaging industry. As IoT and AI applications expand, the demand for advanced packaging solutions rises. These technologies often require compact, efficient, and high-performance packaging to ensure optimal functionality. Advanced packaging meets these demands, offering improved thermal management, miniaturization, and enhanced reliability.


For instance, in August 2020, Samsung Electronics launched its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for the most advanced process nodes. X-Cube enables significant leaps in speed and power efficiency to address the rigorous performance demands of advanced applications including 5G, artificial intelligence, high-performance computing, mobiles, and wearables.

Advanced packaging refers to innovative techniques in semiconductor packaging that enhance the performance, size, and functionality of integrated circuits. This includes technologies such as 3D packaging, wafer-level packaging, and System-in-Package (SiP). Advanced packaging aims to optimize space, improve thermal management & enhance electrical performance, thereby meeting the evolving demands of modern electronic devices for higher efficiency, miniaturization, and improved functionality.


Challenges in thermal management pose a pitfall for the advanced packaging market. As electronic devices become smaller and more powerful, managing heat dissipation becomes critical. Advanced packaging techniques such as 3D integration can exacerbate thermal challenges, leading to overheating issues. Efficient thermal dissipation solutions are essential to prevent performance degradation and ensure the reliability of advanced packaging technologies. Overcoming these thermal management challenges is crucial for sustaining the growth of advanced packaging in various electronic applications.

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

Market size for advanced packaging crossed USD 30 billion in 2023 and is expected to register over 10% CAGR from 2024-2032 owing to an increasing trend of IoT and AI technologies worldwide.

The flip-chip packaging type segment held over 60% share advanced packaging industry in 2023 and is expected to register an appreciable CAGR from 2024-2032 owing to its ability to offer shorter interconnection lengths for reducing signal delays and improving overall electrical performance.

Asia Pacific held over 65% share of the advanced packaging industry in 2023 and is expected to register commendable CAGR from 2024-2032 due to the presence of a strong electronics manufacturing ecosystem in the region.

Amkor Technology, ASE Group, JCET Group Co., Ltd., Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, TongFu Microelectronics Co., Ltd., and UTAC are some of the major advanced packaging companies worldwide.

Advanced Packaging Market Scope

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Premium Report Details

  • Base Year: 2023
  • Companies covered: 16
  • Tables & Figures: 220
  • Countries covered: 21
  • Pages: 220
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