3D IC and 2.5D IC Packaging Market Size

3D IC and 2.5D IC Packaging Market Size

3D IC and 2.5D IC packaging market was valued at over USD 45 billion in 2022 and is anticipated to grow at a CAGR of over 9% between 2023 and 2032. Advancements in manufacturing equipment are driving growth in the industry. Improvements in wafer thinning, bonding, manufacturing processes have made this packaging process more efficient and cost-effective.

In addition, 3D IC and 2.5D IC packaging solutions enable the integration of various sensors, processors, and memory components into a compact form factor, enabling real-time data processing, low latency, and efficient power management that are crucial in AR devices.
 

3D IC packaging refers to the integration of multiple layers or dies vertically, creating a three-dimensional structure. While on the other hand, 2.5D IC packaging involves the integration of multiple dies or chips onto a silicon interposer or an organic substrate.
 

The increasing implementation cost can limit market growth. 3D IC and 2.5D IC packaging is cost prohibitive. The techniques & methods associated with this packaging process will require additional investments in materials, equipment, and expertise. This can deter some smaller or budget-constrained organizations from embracing these technologies, hindering market growth.