Report Content
Chapter 1 Methodology & Scope
1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data Sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 3D IC and 2.5D IC packaging market 360º synopsis, 2018 - 2032
2.2 Business trends
2.2.1 Total Addressable Market (TAM), 2023-2032
2.3 Regional trends
2.4 Technology trends
2.5 Application trends
2.6 End-Use trends
Chapter 3 3D IC and 25D IC Packaging Market Industry Insights
3.1 Impact on COVID-19
3.2 Russia- Ukraine war impact
3.3 Industry ecosystem analysis
3.4 Vendor matrix
3.5 Profit margin analysis
3.6 Technology & innovation landscape
3.7 Patent analysis
3.8 Key news and initiatives
3.8.1 Partnership/collaboration
3.8.2 Merger/Acquisition
3.8.3 Investment
3.8.4 Product launch and innovation
3.9 Regulatory landscape
3.10 Impact forces
3.10.1 Growth drivers
3.10.1.1 Increasing need for advanced architecture in electronic products
3.10.1.2 Advancement in manufacturing technology
3.10.1.3 Rising trend of miniaturization of electronic devices
3.10.1.4 Surge in demand for consumer electronics
3.10.2 Industry pitfalls & challenges
3.10.2.1 High implementation cost
3.10.2.2 Design complexity
3.11 Growth potential analysis
3.12 Porter’s analysis
3.13 PESTEL analysis
Chapter 4 Competitive Landscape, 2022
4.1 Introduction
4.2 Company market share, 2022
4.3 Competitive analysis of major market players, 2022
4.3.1 TSMC (Taiwan Semiconductor Manufacturing Company)
4.3.2 Samsung Electronics
4.3.3 Broadcom
4.3.4 Texas Instrument
4.3.5 Toshiba Corporation
4.3.6 Intel Corporation
4.3.7 Mitsubishi Electric Corporation
4.4 Competitive positioning matrix, 2022
4.5 Strategic outlook matrix, 2022
Chapter 5 3D IC and 25D IC Packaging Market Estimates & Forecast, By Technology (USD Million)
5.1 Key trends, by technology
5.2 3D wafer-level chip-scale packaging
5.3 3D TSV
5.4 2.5D
Chapter 6 3D IC and 25D IC Packaging Market Estimates & Forecast, By Application (USD Million)
6.1 Key trends, by application
6.2 Logic
6.3 Memory
6.4 Imaging & optoelectronics
6.5 MEMS/Sensors
6.6 Others
Chapter 7 3D IC and 25D IC Packaging Market Estimates & Forecast, By End-Use (USD Million)
7.1 Key trends, by end-use
7.2 Telecommunication
7.2.1 By Application
7.3 Consumer electronics
7.3.1 By Application
7.4 Automotive
7.4.1 By Application
7.5 Military and Aerospace
7.5.1 By Application
7.6 Medical devices
7.6.1 By Application
7.7 Smart technologies
7.7.1 By Application
7.8 Others
7.8.1 By Application
Chapter 8 3D IC and 25D IC Packaging Market Estimates & Forecast, By Region (USD Million)
8.1 Key trends, by region
8.2 North America
8.2.1 U.S.
8.2.2 Canada
8.3 Europe
8.3.1 UK
8.3.2 Germany
8.3.3 France
8.3.4 Italy
8.3.5 Spain
8.3.6 Russia
8.4 Asia Pacific
8.4.1 China
8.4.2 India
8.4.3 Japan
8.4.4 Australia
8.4.5 South Korea
8.5 Latin America
8.5.1 Brazil
8.5.2 Mexico
8.6 MEA
8.6.1 UAE
8.6.2 Saudi Arabia
8.6.3 South Africa
Chapter 9 Company Profiles
9.1
