3D IC and 2.5D IC Packaging Market Analysis

3D IC and 2.5D IC Packaging Market Analysis

Based on technology, the market is segmented into 3D wafer-level chip-scale packaging, 3D TSV, and 2.5D. The 3D wafer-level chip-scale packaging segment held a significant market share of over 25% in 2022. 3D WLCSP refers to a packaging technology where multiple chips or dies are stacked vertically and the interconnections between them are made at the wafer level. One of the main advantages of 3D WLCSP include the enabling of small sizes and the reduced size of electronic components. By stacking more chips or dies vertically, the overall footprint of the packaging can be reduced, making it more suitable for space-constrained applications such as mobiles, wearables, and IoT devices.

The 3D WLCSP segment is expected to grow due to the increasing demand for integrated high-performance electronic devices. Mobile devices, wearables, IoT devices, and automotive electronics are some of the key applications where 3D WLCSP is gaining traction. In addition, the other drivers propelling market growth include the demand for smaller sizes, improved performance, and the integration of different products in one package.

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Based on application, the market is segmented into logic, memory, imaging & optoelectronics, MEMS/sensors, and LED. The MEMS/sensor segment is expected to reach over USD 24.5 billion by 2032. 3D IC and 2.5D IC packages have advantages in miniaturization and integration, which is especially important for MEMS and sensors. By stacking multiple dies vertically or mixing different components in one package, the overall MEMS size can be reduced while maintaining or improving its performance. This miniaturization allows the sensor to be integrated into many applications where space is limited such as electronics, automobiles, medical devices, and IoT devices.
 

Furthermore, MEMS and sensors are experiencing significant growth owing to the increasing demand for smart devices and connectivity. The integration of sensors into various applications, such as smartphones, wearables, medical devices, home appliances, and autonomous vehicles, is driving market expansion. The need for advanced sensing capabilities, miniaturization, and integration drives the use of 3D IC & 2.5D IC packaging in the MEMS & sensor space.
 

Asia Pacific 3D IC and 2.5D IC packaging market is expected to grow at a CAGR of over 10% by 2032. Countries including China and India are witnessing exponential growth in trade & production, especially in industries including automobile, electronics, chemicals, and machinery. The Asia Pacific region is home to some of the largest semiconductor chip manufacturers including TSMC, SMIC, UMC, and Samsung. For example, in February 2021, TSMC announced its plan to establish a research & development center in Tsukuba to develop 3D IC packaging materials along with the sale of Japanese products. In addition, such innovations are driving the market in the region.