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Fan-Out Wafer Level Packaging Market Size

  • Report ID: GMI5810
  • Published Date: May 2023
  • Report Format: PDF

Fan-Out Wafer Level Packaging Market Size

Fan-Out Wafer Level Packaging Market size was valued at over USD 2.5 Billion in 2022 and is anticipated to grow at a CAGR of over 10% between 2023 and 2032. The rising demand for advanced and cost-effective packaging technologies as well as increasing digitalization & miniaturization are driving the global fan-out wafer level packaging industry.


As technology develops, there is a rising need to make electronic devices more compact and portable. The fan-out wafer level packaging technology places multiple components on the same substrate, making the module smaller and more energy efficient. This fan-out wafer level packaging technique is used in consumer electronic devices, such as smartwatches & smartphones, incorporated with the Internet of Things (IoT) & Artificial Intelligence (AI), and the automotive industry to create features such as Advanced Driving Assistance Systems (ADAS).


Fan-out wafer level packaging is an Integrated Circuit (IC) packaging technology. The IC is packaged in a Wafer-level Package (WLP), which is fabricated on a semiconductor wafer. The IC is then separated from the wafer by dicing and the individual packages are separated from the wafer. Following the above processes, the individual packages are then tested and sorted. FOWLP outperforms traditional IC packaging technologies such as wire bonding and flip-chip. Smaller form factors, higher densities, and lower costs are among the benefits of FOWLP.


level packaging market growth. The lack of a specific solution to warping has stifled market growth. Warpage is defined as the distortion that occurs when the surface of a molded part does not conform to the design's intended shape. This causes the wafer surface to deform, rendering it unusable. One of the primary causes of this effect is the differential shrinkage of the material in the molded part, which results in a deformed & warped shape rather than a uniform, compact one.

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

Fan-out wafer level packaging (FOWLP) market size was over USD 2.5 billion in 2022 and will record over 10% CAGR from 2023-2032 driven by the rising adoption of advanced and cost-effective packaging technologies

Fan-out wafer level packaging market share from the high-density packaging process segment surpassed USD 1.5 billion in 2022 due to the rising investments in the development of high-density solutions.

Fan-out wafer level packaging industry share from the automotive application segment will expand at 15% CAGR from 2023-2032 owing to the surging requirements for reliability and electro-thermal co-simulation

Asia Pacific recorded over 50% of the fan-out wafer level packaging market share in 2022 owing to the strong presence of numerous foundries and OSAT companies in the region

Fan-Out Wafer Level Packaging Market Scope

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Premium Report Details

  • Base Year: 2022
  • Companies covered: 13
  • Tables & Figures: 217
  • Countries covered: 14
  • Pages: 240
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