Printed Circuit Board Assembly Market Analysis

Printed Circuit Board Assembly Market Analysis

Based on technology, the market is segmented into surface mount assembly (SMT), through-hole assembly, ball grid array (BGA) assembly, mixed technology (SMT/through-hole), and rigid-flex assembly. The surface mount technology (SMT) segment dominated the global market with a share of over 30% in 2022.
 

• Surface mount technology (SMT) is anticipated to continue driving growth in the PCB assembly market due to its numerous advantages. SMT offers smaller component sizes, increased component density, and enhanced electrical performance compared to traditional through-hole assembly methods. As technology evolves, devices are becoming smaller, more complex & efficient, demanding compact yet powerful PCB designs. SMT enables the assembly of these intricate boards, fostering innovation in industries such as consumer electronics, automotive, and healthcare devices.
   
• The rise of IoT and wearable technology further amplifies the need for compact, high-performance PCBs, solidifying SMT's pivotal role in the future of PCB assembly with forecasts pointing toward sustained growth driven by technological advancements and the increasing demand for smaller, more efficient electronics.

Based on type of PCB, the market is divided into rigid PCB, flexible PCB, and metal core PCB. The rigid PCB segment is anticipated to register a CAGR of over 6% by 2032.
 

• Rigid PCBs are poised for significant growth in the PCB assembly market due to several key factors including the demand for more sophisticated & compact electronic devices across various industries such as consumer electronics, automotive, aerospace, and healthcare. Rigid PCBs offer durability, stability, and consistent performance, making them essential in complex electronic systems.
   
• Advancements in technology, such as increased automation in manufacturing processes, miniaturization, and the advent of new materials, are further propelling the growth of rigid PCB assembly. With the continuous innovation and expansion of IoT devices, 5G technology & smart infrastructure, the demand for rigid PCBs is projected to experience robust growth in the foreseeable future.

Asia Pacific printed circuit board assembly market held a share of over 25% in 2023 and is expected to grow at a lucrative pace. Asia Pacific dominates PCB production globally with key manufacturing hubs in China, Japan, South Korea, and Taiwan. This growth is attributed to factors such as the rising consumer electronics demand, rapid industrialization, and the region's role as a manufacturing hub for a variety of industries. Furthermore, the emergence of innovative technologies, such as 5G, IoT, and automotive advancements, boosts the demand for sophisticated PCBs. Furthermore, favorable government initiatives, skilled labor availability, and infrastructure development support the PCB assembly market in the region. As global demand for electronic devices rises, Asia Pacific remains at the forefront of PCB manufacturing, significantly contributing to market growth & innovation.