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Molded Interconnect Devices (MID) Market Share
- Report ID: GMI424
- Published Date: Sep 2022
- Report Format: PDF
Molded Interconnect Devices Market Share
- TE Connectivity
- Mitsubishi Engineering-Plastics Corporation
- GALTRONICS
- Molex LLC
- RTP Company
- BASF
- EMS- Chemie AG
- Ensinger
- Zeon Corporation
- SelectConnect Technologies Suzhou Cicor Technology Co. Ltd (Cicor Group)
are some of the key molded interconnect devices market participants. These companies are focusing on production facility growth to boost their presence in the competitive landscape.
Frequently Asked Questions (FAQ) :
The market size of molded interconnect devices (MID) exceeded USD 500 million in 2021 and is poised to exhibit a CAGR of nearly 10% through 2030, owing to the strong demand for smart consumer electronics.
The two-shot molding segment recorded revenue of around USD 300 million in 2021, given the high-volume production of multi-color, complex products, and multi-material plastics.
The industrial application segment is anticipated to be worth USD 150 million by 2030, owing to the rapid adoption of 3D-MID technology to produce miniaturized RFID tags.
The Asia Pacific held nearly 45% of the molded interconnect devices industry share in 2021, due to the thriving semiconductor sector in South Korea, Taiwan, and India.
Key molded interconnect devices (MID) industry participants include TE Connectivity, Mitsubishi Engineering-Plastics Corporation, GALTRONICS, Molex LLC, RTP Company, BASF, EMS- Chemie AG, Ensinger, Zeon Corporation, and others.
Molded Interconnect Devices Market Scope
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