Report Content
Chapter 1 Methodology & Scope
1.1 Scope and definition
1.2 Methodology & forecast parameters
1.3 COVID-19 impact
1.3.1 North America
1.3.2 Europe
1.3.3 Asia Pacific
1.3.4 Latin America
1.3.5 MEA
1.4 Data Sources
1.4.1 Secondary
1.4.1.1 Paid sources
1.4.1.2 Public sources
1.4.2 Primary
1.5 Industry Glossary
Chapter 2 Executive Summary
2.1 Molded Interconnect Devices (MID) industry 3600 snapshots, 2018-2030
2.2 Business trends
2.2.1 Total Addressable Market (TAM), 2023 - 2030
2.3 Regional trends
2.4 Process trends
2.5 Application trends
Chapter 3 Molded Interconnect Devices (MID) Industry Insights
3.1 Introduction
3.2 COVID-19 impact
3.2.1 Impact by region
3.2.1.1 North America
3.2.1.2 Europe
3.2.1.3 Asia Pacific
3.2.1.4 Latin America
3.2.1.5 MEA
3.2.2 Impact by value chain
3.2.2.1 Research & development
3.2.2.2 Manufacturing
3.2.2.3 Marketing
3.2.2.4 Supply
3.2.3 Impact by competitive landscape
3.2.3.1 Strategy
3.2.3.2 Distribution network
3.2.3.3 Business growth
3.3 Russia-Ukraine war impact
3.4 Molded Interconnect Devices (MID) industry ecosystem analysis
3.4.1 Component suppliers
3.4.2 Manufacturers
3.4.3 End use Landscape
3.4.4 Distribution channel analysis
3.4.5 Vendor matrix
3.5 Profit margin analysis
3.6 Technology & innovation landscape
3.6.1 3D – Molded Interconnect Devices (MID)
3.6.2 Software suits
3.7 Raw material analysis
3.7.1 Special polyamides (nylons)
3.7.2 Thermoplastic polyesters
3.7.2.1 Polybutylene Terephthalate (PBT)
3.7.2.2 Polyetherimide (PEI)
3.7.2.3 Polyphthalamides (PPAs)
3.7.3 Liquid Crystal Polymers (LCPs)
3.7.4 Acrylonitrile Butadiene Styrene (ABS)
3.8 LDS plating material analysis
3.8.1 Electroless copper
3.8.2 Electroless Nickel
3.8.3 Immersion Gold
3.9 Patent landscape
3.10 Key initiative & news
3.11 Regulatory landscape
3.11.1 International
3.11.2 North America
3.11.3 Europe
3.11.4 Asia Pacific
3.11.5 Latin America
3.11.6 MEA
3.12 Industry impact forces
3.12.1 Growth drivers
3.12.1.1 Growing adoption of wearable electronic devices in North America
3.12.1.2 Favorable government regulations for the electronic waste reduction in Europe
3.12.1.3 Proliferation of Electric Vehicles (EV) sector in Asia Pacific
3.12.1.4 Surge in smartphone demand across the globe
3.12.1.5 Growth of semiconductor manufacturing industry in developing countries
3.12.2 Industry pitfalls & challenges
3.12.2.1 High cost fluctuation in raw materials
3.12.2.2 High tooling cost
3.13 Investment portfolio
3.14 Growth potential analysis
3.15 Porter’s analysis
3.15.1 Threat of new entrant
3.15.2 Bargaining power of supplier
3.15.3 Bargaining power of buyer
3.15.4 Threat of substitution
3.15.5 Competitive rivalry
3.16 PESTEL analysis
3.16.1 Political
3.16.2 Economical
3.16.3 Social
3.16.4 Technological
3.16.5 Legal
3.16.6 Environmental
Chapter 4 Competitive Landscape, 2021
4.1 Introduction
4.2 Market share analysis, 2021
4.3 Completive analysis of key market players, 2021
4.3.1 Amphenol T&M Antennas
4.3.2 TE Connectivity
4.3.3 Molex
4.3.4 Harting Mitronics AG
4.3.5 Tongda Group
4.3.6 RTP Company
4.3.7 Teprosa GmbH
4.4 Completive analysis of innovative players, 2021
4.4.1 LPKF Laser & Electronics AG
4.4.2 MacDermid Inc.
4.4.3 Galtronics
4.4.4 Suzhou Cicor Technology Co. Ltd
4.4.5 SelectConnect Technologies
4.5 Vendor adoption matrix
4.6 Strategic outlook matrix
Chapter 5 Molded Interconnect Devices (MID) Market, By Process
5.1 Key trends, by product
5.2 Laser Direct Structuring (LDS)
5.2.1 Market estimates and forecast, 2018 – 2030
5.2.2 Market estimates and forecast, application, 2018 – 2030
5.3 Two-shot molding
5.3.1 Market estimates and forecast, 2018 – 2030
5.3.2 Market estimates and forecast, application, 2018 – 2030
5.4 Others
5.4.1 Market estimates and forecast, 2018 – 2030
5.4.2 Market estimates and forecast, application, 2018 – 2030
Chapter 6 Molded Interconnect Devices (MID) Market, By Application
6.1 Key trends, by application
6.2 Automotive
6.2.1 Market estimates and forecast, 2018 – 2030
6.3 Consumer products
6.3.1 Market estimates and forecast, 2018 – 2030
6.4 Healthcare
6.4.1 Market estimates and forecast, 2018 – 2030
6.5 Industrial
6.5.1 Market estimates and forecast, 2018 – 2030
6.6 Military & aerospace
6.6.1 Market estimates and forecast, 2018 – 2030
6.7 Telecommunication & computing
6.7.1 Market estimates and forecast, 2018 – 2030
6.8 Others
6.8.1 Market estimates and forecast, 2018 – 2030
Chapter 7 Molded Interconnect Devices (MID) Market, By Region
7.1 Key trends, by region
7.2 North America
7.2.1 Market estimates and forecast, 2018 – 2030
7.2.2 Market estimates and forecast, by process, 2018 – 2030
7.2.3 Market estimates and forecast, by application, 2018 – 2030
7.2.4 U.S.
7.2.4.1 Market estimates and forecast, 2018 – 2030
7.2.4.2 Market estimates and forecast, by process, 2018 – 2030
7.2.4.3 Market estimates and forecast, by application, 2018 – 2030
7.2.5 Canada
7.2.5.1 Market estimates and forecast, 2018 – 2030
7.2.5.2 Market estimates and forecast, by process, 2018 – 2030
7.2.5.3 Market estimates and forecast, by application, 2018 – 2030
7.3 Europe
7.3.1 Market estimates and forecast, 2018 – 2030
7.3.2 Market estimates and forecast, by process, 2018 – 2030
7.3.3 Market estimates and forecast, by application, 2018 – 2030
7.3.4 UK
7.3.4.1 Market estimates and forecast, 2018 – 2030
7.3.4.2 Market estimates and forecast, by process, 2018 – 2030
7.3.4.3 Market estimates and forecast, by application, 2018 – 2030
7.3.5 Germany
7.3.5.1 Market estimates and forecast, 2018 – 2030
7.3.5.2 Market estimates and forecast, by process, 2018 – 2030
7.3.5.3 Market estimates and forecast, by application, 2018 – 2030
7.3.6 France
7.3.6.1 Market estimates and forecast, 2018 – 2030
7.3.6.2 Market estimates and forecast, by process, 2018 – 2030
7.3.6.3 Market estimates and forecast, by application, 2018 – 2030
7.3.7 Italy
7.3.7.1 Market estimates and forecast, 2018 – 2030
7.3.7.2 Market estimates and forecast, by process, 2018 – 2030
7.3.7.3 Market estimates and forecast, by application, 2018 – 2030
7.3.8 Spain
7.3.8.1 Market estimates and forecast, 2018 – 2030
7.3.8.2 Market estimates and forecast, by process, 2018 – 2030
7.3.8.3 Market estimates and forecast, by application, 2018 – 2030
7.3.9 Russia
7.3.9.1 Market estimates and forecast, 2018 – 2030
7.3.9.2 Market estimates and forecast, by process, 2018 – 2030
7.3.9.3 Market estimates and forecast, by application, 2018 – 2030
7.3.10 Sweden
7.3.10.1 Market estimates and forecast, 2018 – 2030
7.3.10.2 Market estimates and forecast, by process, 2018 – 2030
7.3.10.3 Market estimates and forecast, by application, 2018 – 2030
7.4 Asia Pacific
7.4.1 Market estimates and forecast, 2018 – 2030
7.4.2 Market estimates and forecast, by process, 2018 – 2030
7.4.3 Market estimates and forecast, by application, 2018 – 2030
7.4.4 China
7.4.4.1 Market estimates and forecast, 2018 – 2030
7.4.4.2 Market estimates and forecast, by process, 2018 – 2030
7.4.4.3 Market estimates and forecast, by application, 2018 – 2030
7.4.5 India
7.4.5.1 Market estimates and forecast, 2018 – 2030
7.4.5.2 Market estimates and forecast, by process, 2018 – 2030
7.4.5.3 Market estimates and forecast, by application, 2018 – 2030
7.4.6 Japan
7.4.6.1 Market estimates and forecast, 2018 – 2030
7.4.6.2 Market estimates and forecast, by process, 2018 – 2030
7.4.6.3 Market estimates and forecast, by application, 2018 – 2030
7.4.7 South Korea
7.4.7.1 Market estimates and forecast, 2018 – 2030
7.4.7.2 Market estimates and forecast, by process, 2018 – 2030
7.4.7.3 Market estimates and forecast, by application, 2018 – 2030
7.4.8 Taiwan
7.4.8.1 Market estimates and forecast, 2018 – 2030
7.4.8.2 Market estimates and forecast, by process, 2018 – 2030
7.4.8.3 Market estimates and forecast, by application, 2018 – 2030
7.4.9 Malaysia
7.4.9.1 Market estimates and forecast, 2018 – 2030
7.4.9.2 Market estimates and forecast, by process, 2018 – 2030
7.4.9.3 Market estimates and forecast, by application, 2018 – 2030
7.4.10 Australia
7.4.10.1 Market estimates and forecast, 2018 – 2030
7.4.10.2 Market estimates and forecast, by process, 2018 – 2030
7.4.10.3 Market estimates and forecast, by application, 2018 – 2030
7.5 Latin America
7.5.1 Market estimates and forecast, 2018 – 2030
7.5.2 Market estimates and forecast, by process, 2018 – 2030
7.5.3 Market estimates and forecast, by application, 2018 – 2030
7.5.4 Brazil
7.5.4.1 Market estimates and forecast, 2018 – 2030
7.5.4.2 Market estimates and forecast, by process, 2018 – 2030
7.5.4.3 Market estimates and forecast, by application, 2018 – 2030
7.5.5 Mexico
7.5.5.1 Market estimates and forecast, 2018 – 2030
7.5.5.2 Market estimates and forecast, by process, 2018 – 2030
7.5.5.3 Market estimates and forecast, by application, 2018 – 2030
7.6 MEA
7.6.1 Market estimates and forecast, 2018 – 2030
7.6.2 Market estimates and forecast, by process, 2018 – 2030
7.6.3 Market estimates and forecast, by application, 2018 – 2030
7.6.4 South Africa
7.6.4.1 Market estimates and forecast, 2018 – 2030
7.6.4.2 Market estimates and forecast, by process, 2018 – 2030
7.6.4.3 Market estimates and forecast, by application, 2018 – 2030
7.6.5 UAE
7.6.5.1 Market estimates and forecast, 2018 – 2030
7.6.5.2 Market estimates and forecast, by process, 2018 – 2030
7.6.5.3 Market estimates and forecast, by application, 2018 – 2030
7.6.6 Saudi Arabia
7.6.6.1 Market estimates and forecast, 2018 – 2030
7.6.6.2 Market estimates and forecast, by process, 2018 – 2030
7.6.6.3 Market estimates and forecast, by application, 2018 – 2030
Chapter 8 Company Profiles
8.1 MID Manufacturers
8.1.1 Amphenol Corporation
8.1.1.1 Business Overview
8.1.1.2 Financial Data
8.1.1.3 Product Landscape
8.1.1.4 Strategic Outlook
8.1.1.5 SWOT Analysis
8.1.2 GALTRONICS
8.1.2.1 Business Overview
8.1.2.2 Financial Data
8.1.2.3 Product Landscape
8.1.2.4 Strategic Outlook
8.1.2.5 SWOT Analysis
8.1.3 Harting Technology Group
8.1.3.1 Business Overview
8.1.3.2 Financial Data
8.1.3.3 Product Landscape
8.1.3.4 Strategic Outlook
8.1.3.5 SWOT Analysis
8.1.4 LPKF Laser & Electronics AG
8.1.4.1 Business Overview
8.1.4.2 Financial Data
8.1.4.3 Product Landscape
8.1.4.4 Strategic Outlook
8.1.4.5 SWOT Analysis
8.1.5 MacDermid Inc
8.1.5.1 Business Overview
8.1.5.2 Financial Data
8.1.5.3 Product Landscape
8.1.5.4 Strategic Outlook
8.1.5.5 SWOT Analysis
8.1.6 Molex LLC
8.1.6.1 Business Overview
8.1.6.2 Financial Data
8.1.6.3 Product Landscape
8.1.6.4 Strategic Outlook
8.1.6.5 SWOT Analysis
8.1.7 RTP Company
8.1.7.1 Business Overview
8.1.7.2 Financial Data
8.1.7.3 Product Landscape
8.1.7.4 Strategic Outlook
8.1.7.5 SWOT Analysis
8.1.8 S2P (Smart Plastic Products)
8.1.8.1 Business Overview
8.1.8.2 Financial Data
8.1.8.3 Product Landscape
8.1.8.4 Strategic Outlook
8.1.8.5 SWOT Analysis
8.1.9 SelectConnect Technologies
8.1.9.1 Business Overview
8.1.9.2 Financial Data
8.1.9.3 Product Landscape
8.1.9.4 Strategic Outlook
8.1.9.5 SWOT Analysis
8.1.10 Suzhou Cicor Technology Co. Ltd (Cicor Group)
8.1.10.1 Business Overview
8.1.10.2 Financial Data
8.1.10.3 Product Landscape
8.1.10.4 Strategic Outlook
8.1.10.5 SWOT Analysis
8.1.11 TE Connectivity
8.1.11.1 Business Overview
8.1.11.2 Financial Data
8.1.11.3 Product Landscape
8.1.11.4 Strategic Outlook
8.1.11.5 SWOT Analysis
8.1.12 Taoglas
8.1.12.1 Business Overview
8.1.12.2 Financial Data
8.1.12.3 Product Landscape
8.1.12.4 Strategic Outlook
8.1.12.5 SWOT Analysis
8.1.13 Teprosa GmbH
8.1.13.1 Business Overview
8.1.13.2 Financial Data
8.1.13.3 Product Landscape
8.1.13.4 Strategic Outlook
8.1.13.5 SWOT Analysis
8.1.14 Tongda Group
8.1.14.1 Business Overview
8.1.14.2 Financial Data
8.1.14.3 Product Landscape
8.1.14.4 Strategic Outlook
8.1.14.5 SWOT Analysis
8.1.15 Yomura Technologies Inc.
8.1.15.1 Business Overview
8.1.15.2 Financial Data
8.1.15.3 Product Landscape
8.1.15.4 Strategic Outlook
8.1.15.5 SWOT Analysis
8.2 Material suppliers
8.2.1 BASF
8.2.1.1 Business Overview
8.2.1.2 Financial Data
8.2.1.3 Product Landscape
8.2.1.4 Strategic Outlook
8.2.1.5 SWOT Analysis
8.2.2 EMS- Chemie AG
8.2.2.1 Business Overview
8.2.2.2 Financial Data
8.2.2.3 Product Landscape
8.2.2.4 Strategic Outlook
8.2.2.5 SWOT Analysis
8.2.3 Ensinger
8.2.3.1 Business Overview
8.2.3.2 Financial Data
8.2.3.3 Product Landscape
8.2.3.4 Strategic Outlook
8.2.3.5 SWOT Analysis
8.2.4 Evonik Industries AG
8.2.4.1 Business Overview
8.2.4.2 Financial Data
8.2.4.3 Product Landscape
8.2.4.4 Strategic Outlook
8.2.4.5 SWOT Analysis
8.2.5 Koninklijke DSM N V (DSM)
8.2.5.1 Business Overview
8.2.5.2 Financial Data
8.2.5.3 Product Landscape
8.2.5.4 Strategic Outlook
8.2.5.5 SWOT Analysis
8.2.6 Lanxess AG
8.2.6.1 Business Overview
8.2.6.2 Financial Data
8.2.6.3 Product Landscape
8.2.6.4 Strategic Outlook
8.2.6.5 SWOT Analysis
8.2.7 Mitsubishi Engineering-Plastics Corporation
8.2.7.1 Business Overview
8.2.7.2 Financial Data
8.2.7.3 Product Landscape
8.2.7.4 Strategic Outlook
8.2.7.5 SWOT Analysis
8.2.8 Shenzhen Sinoplast Advanced Material Co , Ltd
8.2.8.1 Business Overview
8.2.8.2 Financial Data
8.2.8.3 Product Landscape
8.2.8.4 Strategic Outlook
8.2.8.5 SWOT Analysis
8.2.9 Teknor Apex
8.2.9.1 Business Overview
8.2.9.2 Financial Data
8.2.9.3 Product Landscape
8.2.9.4 Strategic Outlook
8.2.9.5 SWOT Analysis
8.2.10 Zeon Corporation
8.2.10.1 Business Overview
8.2.10.2 Financial Data
8.2.10.3 Product Landscape
8.2.10.4 Strategic Outlook
8.2.10.5 SWOT Analysis
