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Industrial Electronics Packaging Market Trends

Report ID: GMI6376
Published Date: Aug 2023
Report Format: PDF

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Industrial Electronics Packaging Market Trends

The trend of miniaturization in electronics components continues, leading to a demand for compact and space-efficient packaging solutions that can accommodate smaller and densely packed electronic parts while providing protection and thermal management. The industry is witnessing an increased use of advanced materials, such as conductive polymers, nanocomposites, and biodegradable materials, to improve performance, enhance thermal conductivity, and address environmental concerns.

Authors: Kiran Pulidindi, Kunal Ahuja

Frequently Asked Questions (FAQ) :

Market size for industrial electronics packaging was valued at around USD 1.9 billion in 2022 and is estimated to reach USD 2.8 billion by the end of 2032, backed by the increasing adoption of industrial automation systems and technologies.

Semiconductor segment is anticipated to grow at 3.5% CAGR through 2032 as the semiconductor sector demands packaging solutions that can withstand harsh vibrations and mechanical stresses experienced.

U.S. market for industrial electronics packaging was worth USD 0.42 billion in 2022 and is anticipated to expand at a significant pace from 2023-2032 owing to the robust electronics manufacturing sector in the region, producing a wide range of electronic components, devices, and equipment.

are DS Smith Plc., Smurfit Kappa Group Plc., UFP Technologies Inc., Sealed Air Corporation, Achilles Corporation, Desco Industries Inc., Orlando Products Inc., Delphon Industries LLC, Summit Container Corporation, Protective Packaging Corporation, among others.