Copper Clad Laminates Market Size

Copper Clad Laminates Market Size

Copper Clad Laminates Market size was over USD 11 billion in 2018 and is projected to expand at over 4.5% CAGR over the forecast timeframe.

Advanced development of semiconductor fabrication technology, electronic assembly technology as well as electronic machine products in addition to printed circuit boards (PCB) fabrication technology are the prime factors which will drive global copper clad laminates market in the coming years. Copper clad lamination offers excellent insulation, conductivity, signal and support transmission which makes it a fundamental raw material for PCB fabrication. Thus, constant advancement of PCB boards and their growing demand in terminal electronic products will positively impact product market during the forecast spell. Furthermore, rapid expansion of downstream electronics information industry such as optical information storage systems and vacuum fluorescent displays, along with substantial expansion of various end-use sectors will positively drive the product market in the near future.

Copper clad lamination demand has gained momentum over the recent years. Owing to the rising demand for 5G infrastructure materials, which will further accelerate the product market size during the anticipated timeframe. Demand for high-frequency transmission network in 5G communication will diminish the distance for signal transmissions and increases the density of receiving signal and transmitting nodes, which in turn will increase the demand of copper clad laminations for 5G communications equipment in the coming few years.

Escalating China–United States trade war may restrain the product market growth in the near term. The economic conflict has increased tariff on various Chinese goods and China being the major supplier in the copper clad laminates market could possibly increase the product prices in various regions to offset its losses in trade wars. Nevertheless, rapid expansion of electronic packaging technology will drive copper clad lamination demand towards reduced size, high speed, light weight, endurance to high temperature, highly thermal dissipation, Conductive Anodic Filament (CAF) resistance, Comparative Tracking Index (CTI) resistance, high modulus, high intensity, high reliability and multiple functional printed circuit boards during the forecast period.