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Global SiC Wafer Reclaim Services Market to reach $1.3 billion by 2030

  • Published Date: September 2, 2022

SiC Wafer Reclaim Services Market size is slated to cross USD 1.3 billion by 2030, as per the latest research report by Global Market Insights Inc.

The need for high-performance 5G chippers and ICs as a major factor inflating the industry potential for reclaimed SiC wafers, due to the accelerating use of 5G technology worldwide. Globally, a number of smartphone OEMs are leaning towards the creation of products that support 5G cellular connectivity. Modern data centers in the commercial IT sector are increasing their need for servers that are not only extremely high-performance but also energy-efficient, which can easily be achieved with the use of SiC wafers. In the upcoming years, the expanding trend of using 5G smartphones will support the SiC wafer reclaim services market expansion.

Global SiC Wafer Reclaim Service Market Size By Application

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Increasing demand for 5-10 inches SiC wafers to push the industry growth

With respect to the diameter size segment, the SiC wafer reclaim services market into below 5 inches, 5-10 inches, and above 10 inches categories. In 2021, the 5-10 SiC wafers registered the largest share of almost 55%. The industry is expanding on account of the increased demand from smartphones and IoT devices that run on batteries. The deployment of 5-10 inches SiC wafer reclaim service in smart electronic products is supported by technological advancements in areas including connectivity and mobility management.

Rising 5G proliferation to push high-frequency device application

The growing need for wireless communication systems is responsible for the growth of the high frequency device sector. High-frequency devices such as 5G communication technology enables virtual connections between everything and everyone, including machines, objects, and devices. Ultra-low latency, large capacity, high speed, ultra-high dependability, and a huge number of connections are all provided by the 5G technology. As per the report, the high frequency device market registered over USD 100 million in 2021.

Browse key industry insights spread across 225 pages with 134 market data tables and 47 figures & charts from the report “SiC Wafer Reclaim Services Market Size By Diameter (Below 5 Inches, 5-10 Inches, above 10 Inches), By Application (Optoelectronics, Power Devices, High Temperature Devices, High Frequency Devices), COVID-19 Impact Analysis, Regional Outlook, Application Development Potential, Price Trend, Competitive Market Share & Forecast, 2022 – 2030” in detail along with the table of contents

Presence of advanced and well-established technologies in Europe

The Europe SiC wafer reclaim services market is anticipated to grow rapidly. The market is expected to expand at a CAGR of over 9% through 2030. The increasing adoption of cutting-edge technologies, such as 5G across consumer electronics, IT, telecom, industrial, transportation, and other sectors is driving the regional growth. The rising deployment of power and high-frequency devices in these sectors will propel European industry.

Competitive strategies by prominent players to strengthen market presence

In order to meet the rising demand, the participants are focusing on inorganic development tactics. Companies have begun to launch websites to sell products in an effort to enhance their market share. Business expansion tactics are also being deployed by companies. For example, in May 2022, RS Technologies Co., Ltd. revealed the development of a new 300mm wafer factory in China. This manufacturing facility is capable of generating 300,000 recycled wafers per month in order to meet the growing demand from a diverse range of industry verticals.

 Mimasu Semiconductor Industry Co. Ltd., Kinik Company, RS Technologies Co., Ltd., and Scientech Corporation are the key players in the SiC wafer reclaim services industry. Phoenix Silicon International Corporation and NOVA Electronic Materials, LLC are other major SiC wafer reclaim services market leaders.

Authors: Preeti Wadhwani, Prasenjit Saha