Power Module Packaging Market Size & Share 2026-2035

Power Module Packaging Market Size

The power module packaging market was valued at USD 3.26 billion in 2025, is expected to rise to USD 3.56 billion in 2026, and is projected to expand at a 9.6% CAGR (2026–2035), reaching USD 8.13 billion by 2035.

The market measures demand-side revenue from substrate, die-attach, interconnection, encapsulation, and housing content embedded in IGBT, SiC MOSFET, GaN, and Si-MOSFET power modules. Electrified transport, renewable-power conversion, industrial automation, and digital infrastructure are widening demand across procurement cycles that do not move in lockstep, reducing dependence on any one application channel.

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Our primary research across packaging material suppliers and power module integrators indicates the market registered USD 2.17 billion in 2022, confirming that a substantial portion of the current scale reflects genuine structural demand accumulation rather than cyclical inventory build — a distinction that supports confidence in the forecast trajectory through the 2026–2035 period even as short-term procurement timing in automotive and industrial channels introduces quarterly variation.

Power Module Packaging Market Trends, Growth Drivers & GMI Forecast Outlook

Power-module packaging demand is shifting toward material stacks that can manage higher switching frequencies, thermal loads, and reliability expectations. Electric-vehicle inverter programs and inverter deployment in renewable energy create volume demand, while qualification capacity, substrate supply, and the cost of advanced attach materials determine how quickly higher-content SiC architectures scale.

Key Drivers

Evidence anchors use cited external data; demand implications and forecast conditions represent GMI analysis.

Electric-vehicle demand affects packaging content through both unit growth and technology mix. Traction inverters require a coordinated substrate, die-attach, interconnection, and encapsulation system, and SiC designs generally demand more thermally resilient materials than conventional silicon assemblies. Global electric-car sales exceeded 20 million in 2025, while China accounted for nearly three-quarters of global electric-car production, concentrating a substantial share of near-term module-packaging pull in Asian automotive supply chains ^{[1]International Energy Agency. "Global EV Outlook 2026." iea.org}.

Renewable-energy conversion provides a separate source of module demand. Solar, wind, and storage systems depend on power conversion equipment whose duty cycles reward thermal management and long service life; annual solar additions are projected to approach 700 GW by 2030 ^{[2]International Energy Agency. "Renewables 2025." iea.org}. This channel supports established IGBT packaging in utility-scale equipment while increasing the commercial case for SiC designs where efficiency and footprint have a higher value.

Advanced architectures increase the value of packaging content per module when they replace alumina substrates, conventional solder, and aluminum wire with silicon-nitride AMB, sintered attach, and copper-based interconnection approaches. NGK's planned 2.5-fold expansion of AMB substrate production capacity signals that qualified supply is responding to this transition ^{[3]NGK Insulators, Ltd. "NGK decides to increase Production Capacity of AMB substrates for Power Semiconductor Modules by approximately 2.5 times." ngk-global.com}. The constraint is not simply equipment availability: each material combination must prove reliability within customer-specific module and inverter designs before it can contribute to production revenue.

Key Restraints

Evidence anchors use cited external data; demand implications and forecast conditions represent GMI analysis.

AMB substrate concentration is an operational constraint because silicon-nitride ceramics, metallization, and bonding processes must satisfy demanding power-cycling and automotive-reliability requirements. Capacity additions do not immediately resolve the issue: material qualification, module validation, and OEM approval introduce sequential timing risk. New European supply initiatives may improve resilience, but customers still need validated alternatives before dual-sourcing changes purchasing behavior.

SiC packaging also faces a technology-cost boundary in high-voltage applications. The U.S. Department of Energy's SiC packaging initiative underscores the remaining development challenge for high-power module prototypes ^{[4]U.S. Department of Energy, Office of Electricity. "Energy Department Advances U.S. Electric Grid Resilience and Reliability with New Transformer and Silicon Carbide Packaging Projects." energy.gov}. In established industrial and renewable applications, the higher cost of advanced die attach and substrate systems can delay adoption when efficiency gains are insufficient to offset a higher module bill of materials.

Automotive validation is a further brake on commercialization. Packaging suppliers must align material innovation with long module-development cycles, thermal-cycling protocols, and functional-safety requirements. As a result, a technically successful substrate, sintering paste, or interconnection system may have a lengthy interval between initial customer engagement and revenue-bearing production programs.

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We view the transition from IGBT to SiC platforms as the central determinant of packaging value capture. The commercial outcome will depend less on device substitution alone than on suppliers' ability to preserve premium material content while automotive customers pursue cost-down programs and qualified alternatives.

Power Module Packaging Market Segment Analysis

By Device Type

IGBT

The IGBT segment generated USD 1.30 billion in 2025 and is projected to account for 32.0% of market revenue by 2035. The power module packaging market continues to rely on IGBT platforms in industrial drives, rail auxiliaries, and established renewable-energy converters, where proven DBC, solder, and wire-bond configurations remain commercially defensible. Their long installed base provides volume stability, although the mix shifts where higher efficiency justifies SiC adoption.

SiC MOSFET

SiC MOSFET modules represented 22.0% of revenue in 2025 and are projected to reach USD 3.08 billion by 2035. Their packaging opportunity is amplified by traction-inverter and high-efficiency converter designs that require superior thermal cycling, reduced parasitic inductance, and higher-temperature performance. Automotive platform wins therefore raise both module volumes and the value of the materials surrounding each die.

GaN

GaN module packaging generated USD 163 million in 2025 and is forecast to grow at a 17.4% CAGR (2026–2035). Its relevance is concentrated in high-frequency, lower-voltage conversion, including compact power supplies and emerging data-center architectures. Transfer-molded formats, thin substrates, and low-inductance interconnections can make GaN packaging structurally distinct from ceramic-baseplated SiC and IGBT module designs.

Si-MOSFET

Si-MOSFET modules held 28.0% of revenue in 2025 and are expected to generate USD 1.38 billion by 2035. Low-voltage drives, white goods, and distributed energy equipment sustain this segment because cost-sensitive applications continue to value mature silicon solutions. Packaging demand remains tied to conventional substrate and wire-bond processes, even as performance-oriented applications migrate toward wide-bandgap alternatives.

Others

Other device formats, including thyristors and diode-based modules, accounted for 5.0% of revenue in 2025 and are projected to represent 3.0% by 2035. These products retain roles in mature rectification and grid-protection applications, but limited architecture change and persistent pricing pressure constrain their influence on the evolving packaging mix.

By Component Type

Substrate DBC/AMB/IMS

Substrates generated USD 1.04 billion in 2025 and are projected to reach USD 2.76 billion by 2035. This category captures the material migration toward AMB structures where SiC modules require improved thermal conductivity, crack resistance, and reliability under demanding duty cycles. The substrate becomes a strategic component because it links device performance to module durability and qualification success.

Baseplate

Baseplates held 15.0% of component revenue in 2025 and are expected to account for 12.0% by 2035. The relative decline reflects baseplate-free, direct-cooled, and double-sided cooling designs that integrate thermal management more closely with the module. This does not eliminate packaging complexity; it redistributes value toward substrates, attach materials, housings, and assembly processes.

Attach Materials

Attach materials generated USD 391 million in 2025 and are forecast to expand at an 11.3% CAGR (2026–2035). Sintering formulations are gaining relevance where high operating temperatures and fatigue resistance matter, particularly in automotive SiC programs. Adoption depends on whether reliability benefits can be carried through the customer's qualification and cost-down process.

Interconnections

Interconnections represented 18.0% of component revenue in 2025 and are projected to generate USD 1.38 billion by 2035. The shift from aluminum wire toward copper ribbon, clips, and planar solutions is driven by current density, inductance, and lifetime requirements. Equipment compatibility and process control will shape how broadly advanced interconnection methods displace conventional wire bonding.

Encapsulant & Housing

Encapsulants and housings generated USD 424 million in 2025 and are expected to account for 12.0% of market revenue by 2035. Their role expands with demand for vibration resistance, environmental protection, and cleaner integration in automotive and industrial systems. Transfer molding is especially relevant where customers seek compact, repeatable module designs.

Others

Other component materials, including thermal interface elements, terminals, and sensing content, accounted for 10.0% of revenue in 2025 and are projected to reach 11.0% by 2035. Greater diagnostic integration and system-level monitoring increase the relevance of these supporting elements, particularly in electrified vehicles and digitally managed industrial power systems.

By End-User Industry

Automotive

Automotive generated USD 1.17 billion in 2025 and is projected to reach USD 3.17 billion by 2035. Traction inverters, onboard chargers, and DC-DC converters make vehicle electrification the most consequential channel for high-content module packaging. The commercial priority is not only more electrified vehicles, but also wider adoption of thermal and interconnection architectures that can meet demanding lifetime requirements.

Industrial

Industrial applications accounted for 28.0% of revenue in 2025 and are projected to generate USD 1.78 billion by 2035. Motor drives, compressors, pumps, conveyors, and machine tools create a diversified base that is less exposed to one OEM platform cycle. Efficiency regulation and retrofit activity support demand, although sensitivity to capital expenditure sustains a preference for established packaging stacks in many applications.

Renewable Energy

Renewable energy generated USD 522 million in 2025 and is forecast to grow at a 10.8% CAGR (2026–2035). Inverter applications require dependable thermal performance over extended field lives, supporting demand for qualified substrate and die-attach systems. Utility-scale systems continue to support IGBT-based assemblies, while applications prioritizing conversion efficiency increasingly create opportunities for SiC packaging.

Rail & Transportation

Rail and transportation represented 8.0% of revenue in 2025 and are projected to generate USD 569 million by 2035. Traction converters and auxiliary systems value long operating lifetimes, vibration resistance, and thermal-cycling capability. This makes the segment technically demanding but comparatively stable for suppliers that can meet qualification and service-life expectations.

Aerospace & Defense

Aerospace and defense generated USD 130 million in 2025 and are projected to account for 4.0% of revenue by 2035. Lower volumes are offset by stringent reliability, environmental, and qualification requirements. Specialized substrate and die-attach solutions retain value where failure tolerance and operating conditions differ materially from commercial automotive applications.

Data Centers

Data centers generated USD 163 million in 2025 and are forecast to grow at a 14.8% CAGR (2026–2035). Rising compute density increases the need for compact, efficient power conversion, making high-frequency GaN and SiC packaging increasingly relevant. The segment favors low-inductance formats and thermal designs that reduce footprint while preserving power-delivery reliability.

Consumer Electronics

Consumer electronics accounted for 3.0% of revenue in 2025 and are projected to represent 2.0% by 2035. The segment remains price sensitive, while a growing share of low-voltage power functionality is addressed by discrete products outside the module-packaging scope. Suppliers therefore face limited room to sustain premium material content.

By Voltage Class

Below 600V

Below-600V modules generated USD 652 million in 2025 and are expected to represent 15.0% of revenue by 2035. This range serves lower-voltage drives, residential solar equipment, and compact conversion systems, where design teams closely weigh cost against the efficiency and footprint benefits of GaN or silicon MOSFET architectures.

600V–1200V

The 600V–1200V class accounted for 38.0% of revenue in 2025 and is projected to reach USD 3.00 billion by 2035. Its broad applicability across traction inverters, industrial drives, charging infrastructure, and solar inverters makes it the central revenue band. Packaging suppliers benefit from exposure to both established IGBT platforms and newer SiC designs.

1200V–1700V

The 1200V–1700V class generated USD 880 million in 2025 and is projected to reach USD 2.35 billion by 2035. Wind converters, rail auxiliaries, and high-power industrial systems require robust insulation, thermal control, and long-cycle durability. These specifications favor advanced substrate and attach solutions even when device migration proceeds gradually.

Above 1700V

Above-1700V modules held 15.0% of revenue in 2025 and are forecast to grow at a 12.2% CAGR (2026–2035). HVDC, medium-voltage drives, and grid-scale storage create demanding use cases where partial-discharge management, insulation integrity, and thermal reliability are central to package design. The segment offers a meaningful technical-value opportunity for qualified suppliers.

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We believe GaN's current contribution understates its strategic importance. As data-center power designers seek smaller passive components and higher-frequency conversion, low-inductance and transfer-molded package formats could alter the future material mix more quickly than a revenue comparison with SiC alone would suggest.

Power Module Packaging Market Regional Analysis

North America Power Module Packaging Market Analysis

North America generated USD 557 million in 2025 and is projected to reach USD 1.31 billion by 2035. The power module packaging market in the region is supported by automotive traction systems, data-center power conversion, industrial drives, and energy infrastructure. Domestic manufacturing incentives increase the strategic value of local SiC packaging capability, although qualified substrate supply remains internationally interconnected.

United States

The United States generated USD 515 million in 2025 and is projected to reach USD 1.20 billion by 2035. Automotive assembly expansion, hyperscale infrastructure, and power-electronics policy support are shaping demand for domestic module capability. The DOE's SiC packaging initiative supports technology development, but commercial supply-chain localization depends on qualification progress across materials and module assembly ^{[4]U.S. Department of Energy, Office of Electricity. "Energy Department Advances U.S. Electric Grid Resilience and Reliability with New Transformer and Silicon Carbide Packaging Projects." energy.gov}.

Canada

Canada accounted for 7.5% of North American revenue in 2025 and is forecast to grow at a 10.2% CAGR (2026–2035). Battery and vehicle investments in Ontario and Quebec create an adjacent manufacturing base for traction-inverter supply chains, while cross-border sourcing will remain important to the development of local module-packaging demand.

Europe Power Module Packaging Market Analysis

Europe represented 22.0% of global revenue in 2025 and is projected to reach USD 1.71 billion by 2035. The region combines automotive demand with a deep base of module manufacturers, substrate suppliers, and industrial power-electronics specialists. Fleet-emissions compliance, renewable integration, and industrial electrification sustain a diversified demand profile.

Germany

Germany generated USD 230 million in 2025 and is projected to account for 27.8% of European revenue by 2035. Its automotive and industrial base gives the country a large installed demand pool for IGBT and SiC module packaging. Local design, assembly, and OEM relationships reinforce Germany's role as a specification center for demanding traction and automation applications.

France

France accounted for 11.9% of European revenue in 2025 and is forecast to grow at an 8.1% CAGR (2026–2035). EV platform activity and grid-stability investments support demand, although the pace of conversion from design activity to packaging consumption depends on vehicle production and power-infrastructure procurement cycles.

Italy

Italy represented 8.4% of European revenue in 2025 and is projected to generate USD 148 million by 2035. Its position is strengthened by domestic SiC manufacturing and module-integration activity, which can shorten coordination between device, package, and end-market requirements. Industrial conversion equipment and grid modernization add a complementary demand base.

Spain

Spain generated USD 70 million in 2025 and is forecast to grow at an 11.0% CAGR (2026–2035). Solar deployment and the Iberian automotive supply chain create a favorable setting for inverter and traction-module demand. Growth will be influenced by the extent to which local conversion-equipment activity translates into regional sourcing of packaging content.

Netherlands

The Netherlands accounted for 7.0% of European revenue in 2025 and is projected to represent 6.7% by 2035. Industrial automation, semiconductor-equipment power systems, and energy-transition infrastructure underpin demand. Its modest relative shift reflects faster expansion in larger European automotive and renewable-energy markets rather than a loss of technical relevance.

Asia Pacific Power Module Packaging Market Analysis

Asia Pacific generated USD 1.69 billion in 2025 and is projected to reach USD 4.40 billion by 2035. The power module packaging market benefits from the region's concentration of EV production, module manufacturing, electronics supply chains, and renewable-energy deployment. Integrated device and assembly ecosystems create substantial scale, but they also intensify competition on qualification, material sourcing, and cost.

China

China generated USD 895 million in 2025 and is projected to reach USD 2.45 billion by 2035. Its EV manufacturing scale, solar deployment, and domestic power-module ecosystem make it the principal regional demand engine. China's role in global electric-car production strengthens local traction-inverter demand and supports broader localization of substrate, attach-material, and assembly supply chains ^{[1]International Energy Agency. "Global EV Outlook 2026." iea.org}.

Japan

Japan generated USD 390 million in 2025 and is projected to account for 18.2% of Asia Pacific revenue by 2035. Long-standing module-manufacturing capabilities and automotive relationships sustain demand across industrial, mobility, and infrastructure applications. Japanese suppliers retain an advantage where customer qualification, production consistency, and high-reliability performance are purchasing priorities.

India

India accounted for 6.2% of Asia Pacific revenue in 2025 and is forecast to grow at a 14.0% CAGR (2026–2035). Two- and three-wheeler electrification, electronics-manufacturing incentives, and an emerging assembly ecosystem create a pathway for rising demand. The key commercial test is whether new packaging capacity attains the automotive-grade quality and material access required for scaled module production.

South Korea

South Korea accounted for 10.9% of Asia Pacific revenue in 2025 and is projected to generate USD 420 million by 2035. Automotive electronics, battery-linked power systems, and semiconductor manufacturing provide complementary demand anchors. Local module growth is tied to the ability of suppliers to serve both domestic vehicle programs and export-oriented electronics value chains.

Latin America Power Module Packaging Market Analysis

Latin America accounted for 3.9% of global revenue in 2025 and is forecast to grow at an 11.0% CAGR (2026–2035). Grid modernization, solar investment, and electrified-vehicle manufacturing are expanding from a smaller installed base. The region's opportunity is closely tied to whether local assembly and conversion-equipment demand evolve alongside infrastructure deployment.

Brazil

Brazil generated USD 54 million in 2025 and is projected to reach USD 165 million by 2035. Renewable-power development, industrial equipment demand, and a growing EV manufacturing presence support packaging consumption. Mining, agriculture, and industrial automation also provide recurring demand for established IGBT module configurations.

Mexico

Mexico accounted for 23.4% of Latin American revenue in 2025 and is forecast to grow at a 10.0% CAGR (2026–2035). Automotive near-shoring strengthens its relevance to North American traction-inverter supply chains. Future packaging demand will depend on whether regional sub-assembly and qualification capabilities deepen alongside vehicle manufacturing investment.

Middle East, Africa & Southeast Asia Power Module Packaging Market Analysis

Middle East, Africa & Southeast Asia generated USD 163 million in 2025 and are projected to account for 4.1% of global revenue by 2035. The combined market spans Gulf infrastructure investment, African renewable-power buildout, and Southeast Asian manufacturing capacity. Its heterogeneous demand profile offers growth opportunities but requires suppliers to address materially different procurement, service, and localization conditions.

UAE

The UAE generated USD 35 million in 2025 and is projected to account for 20.2% of regional revenue by 2035. Utility-scale solar projects, data-center development, and industrial electrification support demand for inverter and power-supply modules. Procurement remains concentrated in large infrastructure programs, making project timing important to annual demand patterns.

Saudi Arabia

Saudi Arabia accounted for 25.8% of regional revenue in 2025 and is projected to generate USD 90 million by 2035. Infrastructure electrification, large solar projects, and industrial-zone development create demand for high-reliability conversion equipment. The market is particularly exposed to the delivery cadence of major energy and construction programs.

Southeast Asia

Southeast Asia accounted for 25.8% of regional revenue in 2025 and is forecast to grow at a 10.1% CAGR (2026–2035). Module and semiconductor assembly operations in Malaysia, Thailand, and Vietnam provide a manufacturing foundation, while renewable-energy projects, industrial drives, and electric two- and three-wheelers support local consumption. The region's strategic value lies in its ability to connect export manufacturing with rising domestic power-electronics demand.

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We expect Asia Pacific to retain its structural lead because vehicle production, power-module assembly, and materials supply are already tightly connected. However, India's developing packaging base and Latin America's infrastructure-led demand could progressively diversify the geographic pattern of qualified module assembly and packaging consumption.

Power Module Packaging Market Share & Competitive Landscape

The power module packaging market share is concentrated among integrated device manufacturers and module specialists that combine semiconductor design, application engineering, assembly capability, and access to qualified materials. The five largest suppliers collectively held approximately 80% of global revenue in 2025, demonstrating the importance of scale, customer qualification history, and vertical integration in competitive positioning.

Infineon Technologies AG

Infineon held 22% of global revenue in 2025. Its position reflects a broad IGBT franchise and expanding SiC module activity across automotive and industrial applications. Scale in device production, module design, and manufacturing enables the company to defend packaging content as customer platforms migrate toward higher-performance architectures.

onsemi

onsemi held 19% of global revenue in 2025. Its automotive and industrial SiC strategy is strengthened by broader power-conversion coverage and customer access in high-efficiency applications. The acquisition of Qorvo's SiC JFET technology business broadened its SiC portfolio for data-center, battery-disconnect, and industrial applications ^{[5]onsemi. "onsemi Completes Acquisition of Qorvo's Silicon Carbide JFET Technology Portfolio." businesswire.com}.

Semikron Danfoss GmbH & Co. KG

Semikron Danfoss held 17% of global revenue in 2025. The company's differentiated automotive module architectures, including advanced cooling and interconnection approaches, position it in premium traction applications. Its industrial and renewable-energy channels also provide a diversified outlet for packaging technologies that prioritize robustness and conversion efficiency.

STMicroelectronics N.V.

STMicroelectronics held 13% of global revenue in 2025. Its SiC strategy is reinforced by vertically integrated manufacturing and automotive program exposure, particularly where onboard charging and DC-DC conversion require improved efficiency and compact thermal design. Manufacturing integration can improve coordination between die availability, package development, and customer ramp timing.

Mitsubishi Electric Corporation

Mitsubishi Electric held 9% of global revenue in 2025. Its strength in rail, industrial drives, and renewable-energy conversion supports a stable base for IGBT packaging while creating a route into higher-voltage SiC applications. Long-cycle infrastructure and industrial relationships reinforce its role in reliability-led procurement environments.

Fuji Electric Co., Ltd.

Fuji Electric remains an established supplier in industrial drives, uninterruptible power supplies, and renewable-energy conversion. Its proprietary module-manufacturing experience supports positioning in applications where established IGBT packaging performance, supply continuity, and application-specific engineering remain central customer requirements.

Hitachi Energy Ltd

Hitachi Energy is positioned in high-power grid, rail, and industrial conversion systems, where module lifetimes and high-voltage capability are particularly important. Its power-electronics heritage supports demand for packaging solutions that can withstand demanding thermal and electrical operating conditions.

StarPower Semiconductor Ltd.

StarPower is a significant domestic Chinese module supplier with expanding IGBT and SiC capability. Its competitive relevance rises as Chinese OEMs and industrial customers place greater value on local qualification, shorter supply chains, and access to domestically integrated module production.

ROHM Co., Ltd.

ROHM is advancing SiC packaging through vertically integrated device and module capabilities. Its collaboration with Infineon on mutual second sourcing for compatible SiC package platforms indicates that customer flexibility and package standardization are becoming competitive considerations alongside electrical performance ^{[6]Silicon Saxony. "Infineon: Cooperation with ROHM on packages for silicon carbide power semiconductors." silicon-saxony.de}.

Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices serves automotive, industrial, and infrastructure applications with a focused portfolio of IGBT and SiC module solutions. Its competitive position is linked to mid-power conversion markets where established relationships and practical application support can outweigh pure scale.

Rogers Corporation (curamik Electronics)

Rogers' curamik business supplies DBC and AMB ceramic substrates to module manufacturers. As an independent component supplier, it is exposed to shifts in substrate architecture and provides an important materials option for customers seeking qualified sources outside vertically integrated module producers.

NGK Insulators, Ltd.

NGK is a key supplier of silicon-nitride AMB substrates used in SiC-grade modules. Its production-expansion plans and European supply initiative illustrate how substrate availability has become a strategic issue for automotive and high-performance power-module supply chains ^{[3]NGK Insulators, Ltd. "NGK decides to increase Production Capacity of AMB substrates for Power Semiconductor Modules by approximately 2.5 times." ngk-global.com}.

Heraeus Electronics

Heraeus supplies die-attach, interconnection, and ceramic-substrate technologies for demanding power-module assemblies. Its competitive role is tied to materials performance, process compatibility, and the ability to support customers through lengthy qualification cycles for advanced SiC designs.

Danfoss A/S — Power Modules Division

Danfoss Power Modules retains a specialized position in industrial and renewable-energy power electronics. Its packaging and converter expertise supports applications where system integration, long service life, and engineering support are critical to customer selection.

Littelfuse, Inc. (IXYS)

Littelfuse's IXYS heritage supports a broad range of thyristor, IGBT, and MOSFET module formats. Its portfolio is relevant in industrial, medical, and transportation applications that value voltage-class breadth and continuity of supply.

Microchip Technology Inc. (Microsemi)

Microchip's Microsemi business serves high-reliability aerospace, defense, and space power applications. Its specialization in demanding specifications differentiates its packaging needs from high-volume automotive designs and supports premium material requirements.

Alpha & Omega Semiconductor

AOS is developing power-module capabilities across IGBT and MOSFET formats. Its manufacturing relationship in India illustrates the growing importance of regional capacity development as customers seek more resilient power-semiconductor and packaging supply chains.

CISSOID S.A.

CISSOID focuses on high-temperature and high-reliability power solutions for aerospace, oil and gas, and industrial applications. Its specialized packaging role reflects a market niche where operating temperature and environmental performance take precedence over high-volume cost optimization.

Recent Industry Developments

Infineon Technologies and ROHM signed a memorandum of understanding in September 2025 to support mutual second sourcing of compatible SiC power-semiconductor packages ^{[6]Silicon Saxony. "Infineon: Cooperation with ROHM on packages for silicon carbide power semiconductors." silicon-saxony.de}. The arrangement covers package-platform compatibility for applications including EV onboard chargers, photovoltaics, energy storage, and AI data centers, indicating that procurement flexibility and standardized thermal designs are becoming more material to customer decisions.

onsemi completed its acquisition of Qorvo's silicon-carbide JFET technology business in January 2025 ^{[5]onsemi. "onsemi Completes Acquisition of Qorvo's Silicon Carbide JFET Technology Portfolio." businesswire.com}. The transaction extends onsemi's SiC power-conversion portfolio into AI data-center power supplies, EV battery disconnects, and industrial solid-state circuit-breaker applications, reinforcing consolidation around broader wide-bandgap device and packaging ecosystems.