Semiconductor Manufacturing Equipment Market size is set to exceed USD 90 billion by 2027, according to a new research report by Global Market Insights Inc.
Rising shift toward vehicle electrification with the increasing adoption of Electric and Hybrid Electric Vehicles (EVs/HEVs) will create growth opportunities for market participants. The increasing production of electric vehicles globally is driving up demand for automotive semiconductors, ICs, and chipsets.
The complexity of chip patterns and functional defects is one of the primary factors limiting the market growth of semiconductor manufacturing equipment. In semiconductor chipsets, Electrostatic Discharge (ESD) can occur if electrostatic charge control fails, contaminating and damaging silicon wafers. This could result in significant functional losses during the IC manufacturing process. To address this, foundry players are heavily investing in cutting-edge machinery such as lithography tools, advanced packaging equipment, and semiconductor test systems. These tools are used to create complex patterns on semiconductor wafers using photomask, etching, and nanoimprinting.
Advancements in wafer packaging technology will positively impact the market expansion
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The wafer manufacturing held 35% of the market share in 2020 and is projected to showcase 7% growth rate through 2027. The market progression is credited to the rising demand for smart consumer electronics such as smartphones, laptops, smart home appliances, and others. Continuous technological innovations and the development of silicon-based wafer systems have resulted in denser packaging requirements for consumer devices, such as MEMS and transistors, which will support the industry growth during the forecast period.
Browse key industry insights spread across 250 pages with 197 market data tables and 22 figures & charts from the report, “Semiconductor Manufacturing Equipment Market Size, By Product (Front-end Equipment [Lithography, Polishing & Grinding, Water Surface Conditioning Equipment], Back-end Equipment [Wafer Manufacturing Equipment, Assembly & Packaging Equipment, Test Equipment]), By Dimension (2D, 2.5D, 3D), By Supply Chain Process (Outsourced Semiconductor Assembly and Test (OSAT), Integrated Device Manufacturer (IDM), Foundry), COVID-19 Impact Analysis, Regional Outlook, Growth Potential, Price Trends, Competitive Market Share & Forecast, 2021 – 2027” in detail along with the table of contents:
Rising integration of 3D fabrication technology will spur the market revenue
The 3D technology segment is estimated to attain a CAGR of 10% till 2027 led by the rising usage of 3D fabrication technology due to the continuous miniaturization of microelectronic devices. It improves the performance of electrical devices operating at higher frequencies, increasing its applications in manufacturing Dynamic Random-Access Memory (DRAMS), NAND, and high-bandwidth memory. In various multicore designs, 3D technology enables high bandwidth density, energy efficiency, and low latency. Furthermore, major industry participants are focusing on expanding their footprints to new regional market through collaboration with local players.
Proliferation of automation technology and advanced wafer architecture will impel the market value
The Outsourced Semiconductor Assembly and Test (OSAT) segment captured 25% of revenue share in 2020 and is poised to expand at more than 8% CAGR by 2027. The market demand is attributed to the rising demand for automation in the wafer-level packaging process by several OSAT firms such as Amcor, ASE, STATS ChipPAC, Powertech, and UTAC Holdings, among others.
Additionally, OSAT firms are prioritizing the integration of 2.5D and 3D wafer architectures in various new compact & handheld devices to provide high functionalities and longer battery life, accelerating the industry expansion for semiconductor manufacturing equipment.
Favorable government initiatives to support semiconductor supply chain infrastructure will create the growth opportunities for North America region
North America semiconductor manufacturing equipment market is anticipated to grow at a CAGR of over 7% during 2021 to 2027 on account of the rising government initiatives to support the global semiconductor supply chain and cater to chip shortages. Furthermore, the government is focusing on spending in the regional semiconductor sector as a result of constant technological advancements in the telecom sector.
Key players operating in the market include Tokyo Electron Limited, Applied Materials, Inc., ASML, KLA-Tencor, LAM RESEARCH CORPORATION, and Dainippon Screen Mfg. Co., Ltd. These companies are constantly engaged in new strategies, such as mergers and acquisitions, to expand their product offerings and meet the high industry demand.