Power Management Integrated Circuit (IC) Market
Get a free sample of this report
Your inquiry has been received. Our team will reach out to you with the required details via email. To ensure that you don't miss their response, kindly remember to check your spam folder as well!
Form submitted successfully!
Error submitting form. Please try again.
Request Sectional Data
Your inquiry has been received. Our team will reach out to you with the required details via email. To ensure that you don't miss their response, kindly remember to check your spam folder as well!
Form submitted successfully!
Error submitting form. Please try again.
The global power management integrated circuit (IC) market gained strong momentum in 2024 and is expected to expand at an outstanding CAGR through 2034. The market growth is primarily attributed to the increasing adoption of advanced technologies like the Internet of Things (IoT), artificial intelligence (AI), 5G communication networks, and electric vehicles (EVs). As these technologies continue to become more ubiquitous, there is a growing need for advanced power management solutions to maximize energy usage, improve device reliability, and accommodate faster charging capabilities.
The increasing use of smart devices, wearable tech, and connected infrastructure further deepens the limits of power management IC capability. Moreover, the focus on renewable energy systems and energy-efficient data centers is producing a sense of urgency for ICs that can deliver performance levels with minimum loss of power. The movement is supported by strict global mandates on energy conservation and a push for reducing electronic waste, so it is pushing manufacturers towards more efficient and less harmful products.
In October 2024, Renesas and Intel partnered to design power management solutions for laptops driven by the Intel Core Ultra 200V series. As part of this association, the companies launched three new products: the RAA225019 power management IC (PMIC), the RAA489301 high-efficiency pre-regulator, and the ISL9241 battery charger.
Among the most compelling promoters of the power management integrated circuit (IC) market is the explosive growth of hybrid electric vehicles (HEVs) and electric vehicles (EVs). Power management ICs play a vital role in regulating battery charging, power conversion, and energy distribution in these vehicles, making them integral features of the transforming automotive sector. Government incentives and eco-awareness are driving the adoption of EVs, and unprecedented demand for high voltage and thermal load handling advanced PMICs is being generated.
Further, the proliferation of IoT devices in consumer electronics, industrial automation, home automation, and healthcare products is a major growth driver. The devices need low-power, efficient, and small form factor ICs to provide extended battery life and smooth operation. 5G technology growth also boosts the demand for power management ICs that can effectively manage power in high-speed, high-frequency communication devices.
Conversely, the high R&D expenses required for producing advanced power management ICs and semiconductor supply chain disruption issues can hinder market growth. The engineering challenges that come with packaging several functions in smaller ICs while ensuring reliability and thermal management are complex. Nevertheless, continuous investment in semiconductor fabs, design automation tools, and material advancements seeks to counter these limitations.
Trendy technologies defining the landscape of power management ICs are the increasing use of wide-bandgap semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC). Wide-bandgap semiconductors are more powerful than traditional semiconductors because they can operate at larger voltages, frequencies, and temperatures to improve electrical performance, which is also useful for better power conversion efficiency, energy loss reduction, and eliminating power supply efficiency degradation, etc. ICs built with GaN and SiC semiconductors have been found in EV chargers, PV and wind inverters, data center power supplies, etc.
Another key trend is the incorporation of machine learning and AI algorithms into power management ICs that allow real-time power optimization based on adaptive power management. This power management strategy enhances device life, minimizes energy waste, and provides an improved user experience.
One should also mention the ascendance of system-in-package (SiP) and multi-chip module (MCM) technologies. Both these methods combine several ICs within a single package, saving footprint and enhancing power efficiency, essential for small consumer electronics and wearables.
For instance, in May 2025, Infineon Technologies AG introduced a new CoolSET System-in-Package (SiP), a small and completely integrated power controller to provide highly efficient power of up to 60 W with an extremely wide input voltage range of 85–305 VAC. With a high-voltage MOSFET with low RDS(ON) in a small SMD package, the solution does not require an external heat sink, thus keeping system size and design complexity to a minimum.
Of different end-user markets, the automotive market is anticipated to see the highest growth rate in the forecast period. The growing penetration of EVs, fuel cell cars, and connected cars necessitates demand for sophisticated power management ICs that effectively control high-voltage battery packs, regenerative braking units, and onboard charging modules. Additionally, autonomous car technology demands power management solutions that assist intricate sensor arrays and AI computing devices with low power consumption.
The consumer electronics market continues to be an important segment, fueled by the pervasive availability of smartphones, tablets, laptops, and wearables. The trend toward miniaturization and the prolonging of battery life creates demand for highly integrated low-power ICs that can handle multiple power rails as well as rapid charge protocols such as USB Power Delivery and Qualcomm Quick Charge.
By region, the Asia Pacific power management integrated circuit (IC) market is projected to be the largest share of the global market with the highest CAGR. The Asia Pacific region has manufacturing centres in China, South Korea, Japan, Taiwan, and other countries and has a developed electronics supply chain, has higher government spending on smart infrastructure, and has a high consumer need for smart devices. North America and Europe are also important markets with strong OEM presence of the automotive industry, semiconductor firms, and the thrust for green energy systems.
Market leaders in the power management IC segment are:
These players are committed to creating ICs with enhanced power density, reduced quiescent current, and superior thermal performance. Strategic alliances, acquisitions, and mergers are typical mechanisms to access new markets and leading-edge technologies.
Investment in R&D to create next-generation power ICs with AI integration, wide-bandgap semiconductors, and advanced packaging technologies continues to be a key priority. This allows manufacturers to meet growing demands for smarter, smaller, and more efficient power management solutions.
In March 2025, Texas Instruments (TI) released a new portfolio of power management chips to help meet the increasing power requirements of data centers today. The TPS1685 is one of them, a 48V integrated hot-swap eFuse with power-path protection optimized to meet the performance and reliability requirements of data center infrastructure.
In March 2025, Infineon launched the TLF35585, a high-reliability power management IC (PMIC) that is designed to address the stringent safety and performance needs of today's automotive systems.