Hermetic Packaging Market Size By Configuration (Multi-layer Ceramic, Pressed Ceramic, Metal Can), By Product (Ceramic-Metal, Glass-Metal, Passivation Glass, Transponder Glass, Reed Glass), By Application (Sensors, Lasers, Transistors, MEMS (Microelectromechanical) Switches, Airbag Initiators, Photodiodes), By Industry (Military & Defense, Aerospace, Automotive, Medical, Telecommunication), Industry Analysis Report, Regional Outlook, Application Growth Potential, Price Trends, Competitive Market Share & Forecast, 2019 – 2026

Published Date: Dec 2019  |  Report ID: GMI4470  |  Authors: Kiran Pulidindi, Soumalya Chakraborty

Report Format: PDF   |   Pages: 165   |   Base Year: 2018




Summary Table of Contents Industry Coverage Methodology

Industry Trends

Hermetic Packaging Market size was valued close to USD 3.5 billion in 2018 and is estimated to exhibit over 7% CAGR from 2019 to 2026. Expanding military & defense sector in the North America is likely to bolster hermetic packaging demand in the global market.
 

Hermetic Packaging Market

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Hermetic packaging helps to protect the impact sensitive electronic devices in various end-use sectors

Hermetic packaging is a type of sealing that offers airtight characteristics, by preventing the passage of gases, liquids, oxygen, air, etc. This packaging protects highly sensitive electronics, including sensors, laser diodes, and optoelectronic components from humidity and corrosion. It also protects the electronic systems against environmental conditions, such as changes in atmospheric pressure, moisture, soil, and other hazards, that could damage electrical connections or delicate electronic components. It plays a critical role in the safe functionality of many healthcare and electronic products by lengthening the service life of electrical components.
 

Growing adoption of hermetic packaging in military & defense sector for the protection of sensitive electronics and enhancing its resistance to harsh environments is a major factor bolstering the hermetic packaging market growth. Large hermetic penetrators are used in nuclear powered carriers and submarines, which offer excellent reliability and safety for mission-critical applications.
 

Moreover, development of military & defense sector in the U.S. owing to the rising geopolitical tensions is further expected to propel the product consumption. For instance, the military spending in the U.S. was over USD 880 billion in 2018.
 

In the aerospace and space sector, the product helps in avoiding any accidents by offering reliable performance in the form of hermetically sealed terminals, connectors, and headers to prevent fuel leakage. Also, surging demand for commercial airliners due to upsurge in international air traffic for tourism as well as business purposes will increase the product demand in safety devices in aircrafts.
 

Moreover, expanding automotive industry in the developing countries of Asia Pacific region offers lucrative opportunities for the product manufacturers. For instance, the number of passenger cars sold in the region was over 39 million units in 2018 while the number of motor vehicles produced in the ASEAN region alone was over 4 million units. The automotive industry uses such packaging techniques in safety devices such as airbag controllers, rollover devices, and seat belt pretensioners which ensures sensor functionality without any failure for a longer period.
 

However, stringent quality standards for hermetic packaging in medical, military & defense, and aerospace industries is likely to hinder the hermetic packaging market during the forecast period. In addition, availability of substitutes such as epoxy resin packaging is likely to challenge the market players over the following years.
 

Hermetic Packaging Market Report Coverage
Report Coverage Details
Base Year: 2018 Market Size in 2018: 3.47 Billion (USD)
Historical Data for: 2016 to 2017 Forecast Period: 2019 to 2026
Forecast Period 2019 to 2026 CAGR: 7.1% 2026 Value Projection: 5.95 Billion (USD)
Pages: 165 Tables, Charts & Figures: 213
Geographies covered (21): U.S., Canada, Germany, UK, France, Spain, Italy, Russia, China, India, Japan, Taiwan, South Korea, Indonesia, Malaysia, Brazil, Mexico, South Africa, Saudi Arabia, UAE, Israel
Segments covered: Configuration, Product, Application, Sector Region
Companies covered (15): SCHOTT AG, AMETEK.Inc., Texas Instruments Incorporated, Teledyne Technologies Incorporated, Amkor Technology, Materion Corporation, KYOCERA Corporation, EGIDE Group, Willow, Micross, Legacy Technologies Inc., Renesas Electronics Corporation, Winchester Interconnect, SGA Technologies Ltd, Special Hermetic Products Inc
Growth Drivers:
  • Development in the USA military & defense sector
  • Rising global demand for commercial aircrafts
  • development in the North America healthcare sector
  • Rising automotive sales in Asia Pacific region
  • Development in electronics sector in Asia Pacific
Pitfalls & Challenges:
  • Stringent standards for hermetic packaging
  • Availability of substitute technology

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Metal can hermetic packaging configuration to hold sway in coming years

In 2018, metal can package segment dominated the global hermetic packaging market share and is likely to grow with a strong CAGR during the forecast timeline. This package consists of a metal base with a sparse amount of lead moving out through a glass seal. It possesses low lead content and are cost-effective than the ceramic counterparts. Also, it has a lower thermal resistance and are used in various linear and hybrid applications in the production of transistors, laser diodes, and military electronics.
 

hermetic packaging market by configuration

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Glass-metal sealing to be the major product segment

The glass-metal sealing segment held the largest share in hermetic packaging market in 2018 owing to its superior reliability and electrical integrity. These seals are excellent insulators and possess a high surface resistance, which further offers long-life sealing in extreme conditions of high pressure and corrosive chemicals. They are used in automotive, aerospace, and medical industries; majorly in pressure and flow sensors, thermal sensors and sealed relays; and implantable medical devices respectively.
 

Transistors are the most common application areas

Hermetic packaging is predominantly used in transistors as it can operate over the military temperature range (−55°C to +125°C) and can prevent it from damaging by corrosive environment. Transistors have rectifying barriers, such as P-N junctions, that are highly sensitive to the active components and other chemical substances, which can be protected by ceramic-metal sealing or glass-metal sealing packages. The packaged transistors are further used in the designing of telecommunication circuits and other electronic appliances.
 

Military & Defense sector to be the most popular end-use industry

Hermetic Packaging Market by Industry

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The military & defense segment accounted for the largest hermetic packaging market in 2018 and is projected to grow at a healthy rate over the coming years. This is due to rising product demand for the protection of military electronics in severe pressure and temperature conditions such as MEMS, electronic warfare systems, and missiles. Ceramic and metal can packages are used in ground-based communications and UAVs which offers high reliability at extreme environment conditions.
 

North America to dominate the global consumption

North America demand will be driven by developments in the U.S. advanced electronics sector

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North America dominated the hermetic packaging market value in 2018 owing to the high consumption of the product in various end-use industries such as medical, aerospace, military & defense, and automotive. Increasing R&D investments in product innovation for its use in military as well as medical electronics further propel the product demand. The U.S. is the leading country owing to expanding military, aerospace, and healthcare projects, which primarily uses hermetic connectors in the production of safe and reliable electronics.
 

Capacity expansion and product launches to play important role

Some of the key players in the global hermetic packaging market trends are SCHOTT AG, AMETEK.Inc., Texas Instruments Incorporated, Teledyne Technologies Incorporated, Materion Corporation, KYOCERA Corporation, EGIDE, Willow, Micross, Legacy Technologies Inc., Winchester Interconnect, Renesas Electronics Corporation, SGA Technologies Ltd, and Special Hermetic Products Inc.
 

Most of the hermetic packaging market players are adopting capacity expansions and product launch strategies to gain competitive edge. For instance, in May 2017, Kyocera launched an ultra-small ceramic package which uses a proprietary multilayer structure with in-built RFID antenna. This packaging finds application in medical equipment control, automotive, and factory automation systems.
 

The hermetic packaging industry research report includes in-depth coverage of the industry with estimates & forecast in terms of revenue in USD billion from 2016 to 2026, for the following segments:

By Configuration

  • Multi-layer ceramic packages
  • Pressed ceramic packages
  • Metal can package

By Product

  • Ceramic-metal sealing
  • Glass-metal sealing
  • Passivation glass
  • Transponder glass
  • Reed glass

By Application

  • Sensors
  • Lasers
  • Transistors
  • MEMS (Microelectromechanical) switches
  • Airbag initiators
  • Photodiodes
  • Others

By Industry

  • Military & defense
  • Aerospace
  • Automotive
  • Medical
  • Telecommunication
  • Others

The above information is provided on a regional and country basis for the following:

By Region

  • North America
    • U.S.
    • Canada
  • Europe
    • Germany
    • UK
    • France
    • Spain
    • Italy
    • Russia
  • Asia Pacific
    • China
    • India
    • Japan
    • Taiwan
    • South Korea
    • Indonesia
    • Malaysia
  • Latin America
    • Brazil
    • Mexico
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE
    • Israel

Frequently Asked Questions (FAQ) :

The valuation of hermetic packaging market in the year 2018 was USD 3.5 billion.
The overall hermetic packaging market is anticipated to record a crcr of 7% through 2026
Hermetic packaging is a type of sealing that offers airtight characteristics, by preventing the passage of gases, liquids, oxygen, air, etc which protects highly sensitive electronics products including sensors, laser diodes and optoelectronic components from humidity and corrosion.
Glass-metal sealing is the largest segment in hermetic packaging owing to its superior reliability and electrical integrity. These seals are excellent insulators and possesses a high surface resistance, which further offers long-life sealing in extreme conditions of high pressure and corrosive chemicals.
The military & defense segment will account for the largest hermetic packaging market share owing to rising product demand for the protection of military electronics in severe pressure and temperature conditions such as MEMS, electronic warfare systems, and missiles.

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Premium Report Details

  • Published Date: Dec 2019
  • Pages: 165
  • Tables: 189
  • Charts / Figures: 24
  • Companies covered: 15
  • Countries covered: 21

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