E-Beam Wafer Inspection System Market size is projected to record stellar growth between 2021 and 2027, driven by the increasing requirement for semiconductor wafers, which has fostered the need for wafer inspection systems. Moreover, the surging miniaturization of the system is poised to create lucrative opportunities for the market in the due course of time.
E-beam wafer inspection systems are semiconductor fabrication tools that rely on electron beam scanning for inspecting killer detects in a wafer. These are used for detecting physical defects as well as pattern defects on wafer while determining the position coordinates of these anomalies. Besides, E-beam wafer inspection systems are usually used by R&D projects wherein accuracy remains the intrinsic need.
The lack of awareness about the features of E-beam wafer inspection systems is anticipated to pose major challenges for the overall market progression in the coming years.
Ongoing innovations in the wafer infection business space are touted to have a positive impact on the global e-beam wafer inspection system industry growth over the forecast time frame. For instance, KLA Corporation had in 2020, introduced a revolutionary eSL10 e-beam patterned-wafer detect inspection system. The new system is developed to accelerate time-to-market for high performance memory and logic chips, by detecting and reporting defects that cannot otherwise be captured by other e-beam defect inspection platforms.
Based on type, E-beam wafer inspection systems with a resolution of 1nm are gaining momentum in the global market. The tools with 1nm resolution enable detection of the most challenging defects that other technologies fail to detect. Besides, these tools are highly used in ramp and production of multiple patterning, R&D, DRAM, FinFET formation, and 3D NAND formation applications. Various companies are providing e-beam inspection tools with smaller resolutions to offer faster throughput and enhanced efficiency, productivity, and performance in complex production processes. To illustrate, Applied Materials, Inc., announced offering PROVision systems, which is an e-beam inspection tool with 1nm resolution. Apparently, the technology enables producers to detect challenging deformities in production environments.
Asia Pacific E-beam wafer inspection system market is characterized by the incredible growth in the semiconductor sector, aligned with the presence of large semiconductor companies. The region is witnessing an increased adoption of these systems by semiconductor manufacturers for high-quality inspection. In addition, significant expansion in the semiconductor industry and rising production capacity are leading to an increased demand for effective wafer inspection systems. Rising investments from governments to bolster the construction of a large number of semiconductor fabrication plants in the region would further strengthen the regional growth.
The global e-beam wafer inspection system market is highly concentrated and boasts the presence of leading companies like Hitachi Ltd, ASML Holding N.V., NXP Semiconductor N.V., Applied Materials Inc., Renesas Electronics Corporation, Taiwan Semiconductor Manufacturing Co. Ltd., Applied Materials Inc., and others. These market players are relentlessly working towards the development of novel products in the business space allowing them to gain a competitive edge in the market.
Considerable decline in the semiconductor industry is expected to negatively influence the global e market in wake of the COVID-19 pandemic. APAC had recorded surging cases of the SARS-CoV2- infection, allowing the governments to impose stringent movement restrictions, and halt in production, thus impeding the growth statistics.