Report License
$4,123 $4,850
15% off
$4,840 $6,050
20% off
$5,845 $8,350
30% off
Order Review
Flip Chip Market - By Packing Technology (3D IC, 2.5D IC, 2D IC), By Bumping Technology (Copper Pillar, Solder Bumping, Gold Bumping), By Packaging Type (FC BGA, FC PGA, FC LGA, FC QFN, FC Sip, FC CSP), By End-use & Forecast 2022-2032
Report ID: GMI6055
Selected License: $4,850
Discount: $727
Order Total: $4,123
Need assistance?
Call us or write to us:
Phone : +1-302-846-7766
Toll-Free : +1-888-689-0688
Email: sales@gminsights.com
What You Get?
- Report accessible by one user only
- 24 hours of customization free with purchase
- Delivery in 24 to 72 hours
- Up to 3 months post-purchase service
- PDF report
