Hermetic Packaging Market size worth around $6 Billion by 2026

According to a new research report by Global Market Insights, Inc., the hermetic packaging market size will likely to reach around USD 6 billion by 2026, growing at a CAGR of 7%. Increasing demand for hermetic packaging in sensitive electronic devices that are primarily used in aerospace, military & defense, automotive and medical industries are likely to fuel the global market growth.

Hermetic packaging in aerospace and military & defense sectors will have significant contribution

The product aids in improving the performance, technological functionality, and safety of these components by providing reliable, durable, and long-term protection against impacts and ambient conditions. These electronic products are highly vulnerable to electrostatic discharge due to corrosion by oxygen and moisture, which leads to failure of static sensitive components. This will create an upsurge in the usage of hermetic packaging in aerospace and military industries.


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Additionally, rising incorporation of the product in medical electronics installed in the human bodies to ensure high functionality of pacemakers and hearing devices is another factor fueling the hermetic packaging market growth. Furthermore, growing healthcare sector in North America increases the regional product consumption. Substantial technological advancements in the portable and smart consumer electronics segment such as smart television, smart speakers, and smartphones are likely to augment the market growth in the foreseen years.

In 2026, multi-layer ceramic packages segment will hold over 30% share in hermetic packaging market owing to its ability to offer complex packaging solutions, including high frequency applications and micro-electronic-mechanical systems (MEMS). It exhibits high temperature durability, excellent heat dissipation, and high-density circuit design, which finds usage in sensor applications in defense, automotive, and medical sectors. Also, it is used in industrial lasers, power electronics, and data communication.

Browse key industry insights spread across 165 pages with 189 market data tables & 24 figures & charts from the report, “Hermetic Packaging Market Size By Configuration (Multi-layer Ceramic, Pressed Ceramic, Metal Can), By Product (Ceramic-Metal, Glass-Metal, Passivation Glass, Transponder Glass, Reed Glass), By Application (Sensors, Lasers, Transistors, MEMS (Microelectromechanical) Switches, Airbag Initiators, Photodiodes),By Industry (Military & Defense, Aerospace, Automotive, Medical, Telecommunication), Industry Analysis Report, Regional Outlook, Application Growth Potential, Price Trends, Competitive Market Share & Forecast, 2019 – 2026” in detail along with the table of contents:

Ceramic-metal sealing is likely to register over 30% share in hermetic packaging market by 2026 with a robust CAGR of around 8%. This sealing can be combined with a complex metal housing, which provides an exceptionally reliable hermetic package with customized optical, electrical, and thermal functionalities. It is employed in complex optoelectronic and electronic systems on account of their large number of inputs/outputs.

Based on application, in 2026, share for sensor segment is likely to be a little less than a fifth of the overall hermetic packaging market due to the product’s ability to ensure functionality of sensors. It is utilized to protect a wide variety of sensors, such as pressure sensors and temperature sensors, found in energy technology, aircrafts, engine management, vehicle stability controls, and in-car climate modulations. The product offers high resistance to temperature fluctuations, aggressive chemicals, and pressure changes, which will propel its consumption in the production of sensors.

The automotive sector is estimated to witness a considerable growth during the review period owing to the rising consumption of the hermetic packaging in highly sensitive automotive safety devices such as seat belt sensors, airbag initiators, and crash sensors. The product used in sensors ensures high resistance to corrosive chemicals and temperature fluctuations.

Asia Pacific to grow at the highest rate over the forecast timespan

Asia Pacific market will reach over USD 1.8 billion by 2026 due to the upsurge in product consumption, mainly in electronics used in automotive, military, and aerospace industries. Increasing concern over damage and corrosion of sensitive electronics used in airbags, medical devices, and military warfare systems are likely to significantly propel the regional hermetic packaging market sales.

Manufacturers focusing on product development and capacity expansion to gain competitive edge

Some participants in the hermetic packaging industry include Texas Instruments Inc., SCHOTT AG, Materion Corporation, Teledyne Technologies Inc., Special Hermetic Products EGIDE, AMETEK.Inc., Willow, Micross, KYOCERA Corporation, Renesas Electronics Corporation, Winchester Interconnect, SGA Technologies, and Legacy Technologies. Focused expansions, research and development activities, new product launches, mergers & acquisitions are some of the major strategies adopted by the key industry players to gain significant position in the market.

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