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Electronic Thermal Management Materials Market Size Worth Over $8.7 Billion by 2026

  • Published Date: January 24, 2020

According to a new research report by Global Market Insights Inc., the global electronic thermal management materials market size shall exceed $8.7 billion by 2026.

Electronic thermal management materials are essential in heat controlling within the electronic device or assembly and helps in its effective conduction. The growing research and development expenditure for the development of complex electronic circuits is projected to create ample opportunities in the coming years. Moreover, the rising need for state of art thermal interface materials in automotive (engine control units) is anticipated to create innovation opportunities for the electronic thermal management materials market manufacturers.

Reduction of electronics size will boost product demand

The reduction in size of electrical assemblies and the availability of new products have made management of temperature a vital need. The thermal management of switchboards and other panels is of utmost importance in industrial maintenance. These products keeps the heat generation in check and aids in efficient functioning of the industrial electronics.

Thermal management of electronic devices can be achieved through various products. Thermal conductive pastes, films and gap fillers are generally adopted by various market player to provide protection to electronic components. Gap fillers are widely employed as a solution for microelectronic applications and for large-format power electronics and the cooling plates. These fillers also possess technical advantages such as excellent isolation and vibration dampening.

Diverse product application in key end-user industry

Electronic thermal management materials market landscape has diverse end-user segments including consumer electronics, aerospace, automotive, telecom, healthcare, etc. The global demand for these materials is influenced by its growing use in electronics industry. Thermal adhesive tapes are widely used to bond electronic components to heat sinks. These are preferred for thermal management of the LEDs in the automotive industry owing to their high mechanical strength and good shock resistance.

Automotive innovation is directly related to the advances in incorporation of state of art electronic features into modern vehicles. The prioritization of safety, emission control, efficiency, reliability and performance depends hugely on electronic systems which, subsequently requires increasing need for thermal performance. Thus, this growing trend will set a positive effect on the overall Electronic thermal management materials market in the coming years.

Browse key industry insights spread across 462 pages with 688 market data tables & 22 figures & charts from the report, “Electronic Thermal Management Materials Market Size By Product (Conductive Pastes [Silicone, Epoxy, Acrylic], Conductive Tapes, Phase Change Materials [Paraffin, Salt Hydrates], Gap Fillers [Silicone, Non-silicone], Thermal Greases [Silicone, Non-silicone]), By End-user (Consumer Electronics, Automotive, Aerospace, Healthcare, Telecom), Industry Analysis Report, Regional Outlook, Application Growth Potential, Price Trends, Competitive Market Share & Forecast, 2019 – 2026” in detail along with the table of contents:

Growing need for heat dissipation in consumer electronic devices

Electronic components generates operating heat and depends on dissipating mechanism for longevity for the product life. Thermal interface material are widely preferred in printed circuit boards as an effective way to divert the heat away and provide with effective heat conduction. The electronic thermal management materials can drastically cut down the thermal resistance by filling the gaps between the electronic components. This growing heat dissipation requirement especially in consumer electronics shall boost the overall electronic thermal management materials market growth.

Growing electronics market mainly in Japan, Taiwan and India

ETMM demand in the Asia Pacific region is set to generate maximum gains in the coming years. Developing the telecommunication and electronics sector shall attribute to electronic thermal management materials market share by 2026. For instance, the Government of India introduced the National Digital Communication Policy in 2018 that aims in attracting USD 100 Billion worth of investment by 2022. These encouraging government policies in this region will invite manufacturers to enter the lucrative Asia Pacific market, in turn, create huge opportunities in the region.

North American electronic thermal management materials market trends are also expected to achieve significant growth due to its large investment in healthcare applications, increasing use of electric and hybrid vehicles and growing data centers across the region.

Competitive industry landscape is competitive due to presence of small and large companies

Electronic thermal management materials industry is competitive with the presence of numerous small and large-scale manufacturers in the value chain. Some of the key players include 3M, Parker Chomerics, European Thermodynamics, Boyd, Dr Dietrich Muller Gmbh, Wacker AG, Darcoid company, Laird PLC, Lord Corporation, Amerasia International (AI) Technology, Henkel AG & Company, Marian Inc, Honeywell International Inc and Dupont.

Authors: Kiran Pulidindi, Sayan Mukherjee

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