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Acoustic Diaphragm Market size to reach $35 Bn by 2032

  • Published Date: February 9, 2023

Acoustic Diaphragm Market size is anticipated to cross USD 35 billion by 2032, according to a new research report by Global Market Insights Inc.

The study cites that the mounting demand for earphones and headphones, accentuated by the proliferation of wireless technology in audio devices and increasing penetration of smartphones and the internet in the remotest parts of the world, will boost product demand.

As proof, recent estimations by FICCI (Federation of Indian Chambers of Commerce & Industry), an India-based non-governmental advocacy and trade association group, suggest that the headset market gains in India may reach US$ 77 million by 2027, depicting a 4.7% CAGR. The growth is primarily credited to the increasing popularity of wireless headsets among consumers, especially the youth. These estimates have laid focus on the flourishing earphones and headphones market globally, which, in consequence, will propel acoustic diaphragm sales.

Paper acoustic diaphragms to become popular due to their exceptional moisture resistance

Based on material, the acoustic diaphragm market value from the paper segment is estimated to surpass USD 9.4 billion by 2032. The segment expansion can be attributed to the extensive usage of paper diaphragms as acoustic diaphragms in acoustic transducer devices such as loudspeakers and microphones. Acoustic diaphragms made of paper offer excellent acoustic characteristics and superior moisture resistance, which will further add to their popularity.

Browse key industry insights spread across 375 pages with 170 market data tables & 23 figures & charts from the report, “Acoustic Diaphragm Market Size, by Material (Wood, Paper, Polypropylene, Polycarbonate, Polyester Film, Polyamide, Polyether Ether ketone, Glass), and End-user (Earphone & Headphone, Loudspeaker & AI Speaker [Car Speaker], Microphone [Notebook, Mobile]), Regional Outlook, Application Potential, Competitive Market Share & Forecast, 2023– 2032” in detail along with the table of contents:

Introduction of wireless technology to drive acoustic diaphragm demand in earphones and headphones segment

In terms of end-user, the earphone & headphone segment is slated to expand at over 6% growth between 2023 and 2032. The integration of an acoustic diaphragm in earphones and headphones offers improved sound quality, high internal loss, low density, etc., and improves their mechanical properties. Technological innovations such as the incorporation of wireless technology in earphones and headphones and growing consumer inclination toward stylish and appealing designs will further augment product sales.

Asia Pacific to emerge as a lucrative growth pocket due to improving economic landscape

Asia Pacific acoustic diaphragm market is poised to depict gains at nearly 6.5% and record a valuation of USD 12.7 billion by 2032. The rapid growth of the electronics industry across numerous regional economies will foster product demand in APAC. Furthermore, the increasing popularity of advanced sound systems with better sound output led by improved economic outlook and rising disposable incomes will support regional expansion.

Acquisitions to outline the competitive outlook

Mica Manufacturing Co. Pvt. Ltd., Materion Corporation, Foster Electric Company, Limited, Poyun Enterprise, Elmetric AB., Vansonic Enterprise Co., Ltd, Loudspeaker Components, LLC, VOZ Electonic Co., Tectonic, and Vesper Technologies are leading players in the acoustic diaphragm market. Major companies operating in this industry are adopting different growth strategies to remain competitive in the market.

To cite instance, in September 2021, Materion Corporation, a leading company dealing in high-performing advanced materials, entered into an accord to acquire the preeminent electronic materials business of H.C. Starck Solutions in Newton, Massachusetts. HCS-Electronic Materials make use of extensive material science and proprietary technological know-how to provide niobium- and tantalum-based premium products and services for the industrial, semiconductor, and aerospace & defense markets.

Authors: Kiran Pulidindi, Kunal Ahuja