High Temperature Adhesives Market Size, Potential, Industry Outlook, Regional Analysis, Application Development, Competitive Landscape & Forecast, 2021 – 2027

Report ID: GMI249

Summary Methodology

Global high temperature adhesives market size is expected to reach over USD 4.5 billion by 2023 and is likely to witness gains with an estimated CAGR of over 4.55 from 2016 to 2023.

E&E industry is the major end-use segment for the high temperature adhesives market. Global Electronic adhesives market demand was estimated at 1.1 million tons in 2014 and is likely to grow with an estimated CAGR of over 10.5% up to 2023. Revenue was estimated at USD 3.28 billion in 2014 and is likely to exceed USD 7.5 billion by 2023.

Increasing bonding agents demand for applications above 150°C in end-use industries such as marine, electronics & electrical (E&E), aerospace and automotive is likely to drive market over the next seven years. These adhesives are widely preferred to join substrates such as metal, glass, rubbers & plastics and replace traditional joining methods such as mechanical fastening and thermal joining.

These adhesives are classified on the basis of polymer such as epoxy, polyurethane, polyamide and silicone. These products are used in different industrial applications based on the operative temperature, cost and durability. Silicone and high temperature epoxy adhesives are major polymers preferred in the E&E industry owing to increase in manufacturing demand for printed electronic circuit and electronic chips.

The electronics industry widely prefers these adhesives owing to reduce the cost and weight of the designed products by replacing mechanical fasteners. These products also have intrinsic thermal & conductive properties which make them preferable materials of choice in place of soldering. Epoxy adhesives are widely used in E&E industry owing to high glass transition temperature that helps and have excellent environmental durability.

Growth of automobile industry coupled with need to reducing vehicle weight to increase fuel efficiency and curb carbon emissions is likely to drive market growth. Polyamides are widely preferred polymer type used in automobile industry owing to their properties to bear high temperature and pressure in load bearing & dynamic applications. These polyamides adhesives are used in thrust washers, lockout inserts, hydraulic components and seal rings. Growing importance of high performance plastics and ceramic parts is likely to favor high temperature adhesives industry growth over the next seven years.

Increasing application scope coupled with aerospace industry growth is likely to positively influence market growth. Adhesives used in aerospace applications are expected to operate in extreme environments. They are also likely to exhibit high-temperature capabilities for marinating the mechanical strength and structural integrity at intended service temperatures.

Adhesives systems that meet some of these requirements can be based on polymers such as silicones, epoxies, phenolics and polyamides. Tile bonding for temperature protection in space shuttle is one such application in the aerospace industry.

Asia Pacific high temperature adhesives market was the dominant region over the past few years and is likely to witness highest gains over the forecast period. Countries such as China and India are likely to witness an increase in consumer electronics demand owing to growth in per-capita middle class disposable income levels coupled with population expansion. Thailand and Indonesia are likely to witness an increase in foreign investment in automobile sector owing to favorable government policies supporting tax incentives which could increase the consumption.

Europe is likely to witness moderate gains over the forecast period owing to growth of automobile industry. Countries in this region such as UK, France and Germany are focusing to develop low weight automobiles by using high performance based plastics to curb emission levels. These aforementioned factors are likely to support market growth over the forecast period.

North America high temperature adhesives market is likely to witness steady growth rates over the forecast period. Growth of aerospace industry in the U.S. has led to the recognition of specific needs of high temperature adhesives. These include materials capable of withstanding temperature close to 500°C for several minutes during missile flight and adhesives able to endure temperatures of 250°C for several thousand hours on advance military aircraft.

The global high temperature adhesives market share is fragmented with top companies competing with each other on the basis of prices coupled with product innovation to meet customer requirements. Key companies operating in this market include Dow Corning, 3M Company, Master Bond Inc. and Henket. Other prominent companies include Three Bond Corp. Ltd., Delo Industrial Adhesives, Permabond LLC and Cotronics Corp.


What Information does this report contain?

Historical data coverage: 2013 to 2015; Growth Projections: 2016 to 2026.
Expert analysis: industry, governing, innovation and technological trends; factors impacting development; drawbacks, SWOT.
6-7 year performance forecasts: major segments covering applications, top products and geographies.
Competitive landscape reporting: market leaders and important players, competencies and capacities of these companies in terms of production as well as sustainability and prospects.

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