Report Content
Chapter 1 Methodology & Scope
1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation.
1.4 Data Sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources.
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Flip chip market 3600 synopsis, 2018 - 2032
2.2 Business trends
2.2.1 Total Addressable Market (TAM)
2.3 Regional trends
2.4 Packaging technology trends
2.5 Bumping technology trends
2.6 Packaging type trends
2.7 End-use trends
Chapter 3 Flip Chip Market Insights
3.1 Impact on COVID-19
3.2 Russia- Ukraine war impact
3.3 Industry ecosystem analysis
3.4 Vendor matrix
3.5 Profit margin analysis
3.6 Technology & innovation landscape
3.7 Patent analysis
3.8 Key news and initiatives
3.8.1 Partnership/Collaboration
3.8.2 Merger/Acquisition
3.8.3 Investment
3.8.4 Product launch & innovation
3.9 Regulatory landscape
3.10 Impact forces
3.10.1 Growth drivers
3.10.1.1 Technological advancements in flip chip packaging
3.10.1.2 Surging demand for miniature silicon packaging in electronic devices
3.10.1.3 The growth of the IOT and wearable devices
3.10.1.4 Increasing demand for high-performance computing
3.10.1.5 The growth of data-intensive applications, including 5g networks
3.10.2 Industry pitfalls & challenges
3.10.2.1 High initial investment
3.10.2.2 Intellectual property and supply chain challenges
3.11 Growth potential analysis
3.12 Porter’s analysis
3.13 PESTEL analysis
Chapter 4 Competitive Landscape, 2022
4.1 Introduction
4.2 Company market share, 2022
4.3 Competitive analysis of major market players, 2022
4.3.1 Intel Corporation
4.3.2 Taiwan Semiconductor Manufacturing Company Limited (TSMC)
4.3.3 Samsung Electronics Co., Ltd.
4.3.4 ASE Technology Holdings
4.3.5 Powertech Technology Inc.
4.3.6 Texas Instruments Inc.
4.3.7 3M
4.4 Competitive positioning matrix, 2022
4.5 Strategic outlook matrix, 2022
Chapter 5 Flip Chip Market, By Packaging Technology (Revenue)
5.1 Key trends, by packaging technology
5.2 3D IC
5.3 2.5D IC
5.4 2D IC
Chapter 6 Flip Chip Market, By Bumping Technology (Revenue)
6.1 Key trends, by bumping technology
6.2 Copper Pillar
6.3 Solder Bumping
6.4 Gold Bumping
6.5 Others
Chapter 7 Flip Chip Market, By Packaging Type (Revenue)
7.1 Key trends, by packaging type
7.2 FC BGA
7.3 FC PGA
7.4 FC LGA
7.5 FC QFN
7.6 FC Sip
7.7 FC CSP
Chapter 8 Flip Chip Market, By End-Use (Revenue)
8.1 Key trends, by end use
8.2 IT Telecommunication
8.3 Industrial
8.4 Electronics
8.5 Automotive
8.6 Healthcare
8.7 Aerospace and Defense
8.8 Others
Chapter 9 Flip Chip Market, By Region
9.1 Key trends, by region
9.2 North America
9.2.1 U.S.
9.2.2 Canada
9.3 Europe
9.3.1 UK
9.3.2 Germany
9.3.3 France
9.3.4 Italy
9.3.5 Spain
9.4 Asia Pacific
9.4.1 China
9.4.2 India
9.4.3 Japan
9.4.4 South Korea
9.4.5 Taiwan
9.5 Latin America
9.5.1 Brazil
9.5.2 Mexico
9.6 MEA
9.6.1 UAE
9.6.2 South Africa
9.6.3 Saudi Arabia
Chapter 10 Company Profiles
10.1 3m
10.2 Advanced Micro Devices Inc.
10.3 Amkor Technology
10.4 ASE Technology Holdings
10.5 Chipbond Technology Corporation
10.6 ChipMOS Technologies Inc.
10.7 Intel Corp
10.8 Jiangsu Changjiang Electronics Tech Co
10.9 Powertech Technology Inc.
10.10 Samsung Electronics Co., Ltd.
10.11 Taiwan Semiconductor Manufacturing Company Limited
10.12 Texas Instruments Incorporated
10.13 Toshiba Corporation
10.14 United Microelectronics Corp.
10.15 UTAC Holdings Ltd.
