Thin Wafer Market Size, By Thickness (>200μm, 100μm - 199μm, 50μm - 99μm, 30μm - 49μm, 10μm - 29μm, <10μm), By Wafer Size (100 mm, 125 mm, 200 mm, 300 mm), By Process (Temporary Bonding & Debonding, {Ultra violate (UV)-release Adhesives, Thermal-release Adhesives, Solvent-release Adhesives}, Carrier-less Approach/Taiko Process), By Application (Micro-Electro-Mechanical Systems (MEMS), Complementary Metal–Oxide–Semiconductor (CMOS) Image Sensors, Memory, Radio-Frequency (RF) Devices, Light-Emitting Diode (LED), Interposers, Logic), Industry Analysis Report, Regional Outlook, Growth Potential, Price Trends, Competitive Market Share & Forecast, 2021 – 2027

Published Date: Mar 2021  |  Report ID: GMI5007  |  Authors: Preeti Wadhwani, Shubhangi Yadav

Report Format: PDF   |   Pages: 232   |   Base Year: 2020




Research Process Flow

Research process Flow

Forecast Approach & Flow

Forecast Approach & Flow

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Premium Report Details

  • Published Date: Mar 2021
  • Pages: 232
  • Tables: 200
  • Charts / Figures: 32
  • Companies covered: 15
  • Countries covered: 13

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