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Hermetic Packaging Market Size, Share and Industry Analysis by Configuration (Multi-layer Ceramic, Pressed Ceramic, Metal Can), Product (Ceramic-to-Metal, Glass-to-Metal, Passivation Glass, Transponder Glass, Reed Glass), Application (Sensors, Lasers, Transistors, MEMS (Microelectromechanical) Switches, Airbag Initiators, Photodiodes) and Industry (Military & Defense, Aerospace, Automotive, Medical, Telecommunication), Regional Outlook, Competitive Landscape & Forecast, 2021 – 2027

  • Report ID: GMI4470
  • Published Date: Aug 2021
  • Report Format: PDF

Industry Overview

Hermetic Packaging Market size was valued at around USD 3.1 billion in 2020 and is estimated to exhibit a CAGR of over 8.5% from 2021 to 2027.

Air transportation is likely to witness moderate growth in the coming years. It will be majorly driven by the middle-class populace in emerging economies. Robust economic development, improvement in living standards, favorable demographics, and increasing disposable incomes are some of the factors that will positively influence the growth of air transportation in these countries. Growth can be ascribed to rapidly growing e-commerce activities in emerging economies and improving air connectivity to smaller cities. In 2018, air passengers across the globe accounted for over four billion, which is likely to increase in the coming years.

Hermetic Packaging Market Outlook

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Over the last decade, the number of air passengers increased by more than 60%. The emergence of low-fare business models from regional airlines and low-cost carriers has revolutionized the airline business. It has resulted in an increased number of air passengers, especially from the middle-class population. Increasing air freight & transportation and the annual number of air passengers have triggered the demand for commercial aircraft. To fulfill the increasing demand, more than 40,000 new aircraft are required in the next two decades.

The aerospace industry widely uses hermetically sealed terminals and hermetically sealed headers & connectors in various airplane systems. For instance, a flight data recorder or black box utilizes hermetic connectors to ensure the integrity of delicate electronics. Moreover, fuel systems and fuel tanks use hermetic connectors in their sensor systems to notify and prevent the seepage of fuel. Rising demand for commercial aircraft will boost the global hermetic packaging market growth in the near future.

The ongoing COVID-19 pandemic significantly disrupted the supply chain across major end-use sectors. Nationwide lockdown, temporary suspension of international trade & travel, partial shutdown of manufacturing facilities, and restrictions on mobility were some of the methods adopted by the majority of the countries to prevent the further outburst of the pandemic, which has substantially influenced the hermetic packaging market share.

Metal-can be the most popular configuration

In 2020, metal can configuration generated around USD 1.7 billion. A metal can package consists of a metal base containing leads leaving through a glass seal, which can be matched sealed, or compression sealed. Once the device assembly is done, a metal can or lid is welded to the metal base to form the hermetic seal. Metal can packages are cost-effective and usually have a low lead count (less than 24 leads). These packages are majorly preferred for hybrid and linear applications. These packages are the most popular and are used for older applications such as for the batteries of an airplane, etc.

Glass-to-metal sealing will be the preferred product type

Hermetic Packaging Market By Product

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In 2020, glass-to-metal sealing product type accounted for over 40% share in the global hermetic packaging industry. This product type has excellent electric insulation characteristics, high dielectric properties, and can withstand temperatures between -65 °C to +250 °C. It is used in a wide range of applications, requiring hermeticity including automotive, aerospace, batteries, high vacuum, electronic packages, sensor packages, military, medical, etc.

Transistors will be the major application segment

Hermetic Packaging Market By Application

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In 2027, the transistor application segment is anticipated to hold around one-third share in the hermetic packaging market. Hermetic sealing of transistors ensures its protection from contamination and in high-temperature applications. Transistors are used in almost everything from computers to stovetops and airplanes to pacesetters.

Transistors are commonly used in digital & analog switches, equipment controllers, signal amplifiers, and power regulators. The extensive usage of transistors in integrated circuits as a switch, for current amplification, etc., coupled with increasing developments in the global military & defense, aerospace, medical, electronics, and telecommunication sectors will prosper product demand in this application segment.

The military & defense sector will dominate the market

Military and defense sector accounted for over USD 1.1 billion in 2020. Increasing expenditure in military & defense, especially in the U.S., will primarily drive the hermetic packaging market growth in this sector. In the military & defense sector, hermetic packaging is majorly used for the packaging of electronic components such as thermal imaging systems, laser range finders, radar systems, various electronic warfare equipment, etc. Ongoing research & development activities, changing political scenarios, etc., are few factors increasing military spending across the world.

North America will be the most lucrative market

Hermetic Packaging Market By Region

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The North America will exceed USD 2.1 billion by 2027 due to an extensive product demand in major end-use regional sectors. Increasing defense expenditure in the U.S. will drive the usage of hermetic packaging in the regional military & defense sector. The presence of the world’s leading aircraft manufacturers coupled with high standards of the regional medical industry will also augment the hermetic packaging market revenue in the coming years.

New product launches, partnerships, acquisitions, and capacity expansion to prosper the industry foothold

Key players in the global hermetic packaging industry are Special Hermetic Products Inc., SGA Technologies Ltd., Renesas Electronics Corporation, Winchester Interconnect, Legacy Technologies Inc., Micross, Willow Technologies, EGIDE, KYOCERA Corporation, Materion Corporation, Teledyne Technologies Incorporated, Texas Instruments Incorporated, AMETEK Inc., and SCHOTT AG.

Some of the key product manufacturers have adopted several aggressive strategies such as capacity expansion, product launches, acquisitions, etc., to augment their competitive edge in the market. In 2019, Schott AG launched a range of hermetic packaging products using its revolutionary HEATAN technology, which has strengthened the product portfolio of the company. In March 2017, EGIDE acquired Santier Inc., one of the leading manufacturers of engineered thermal management materials and hermetic assemblies. This acquisition enabled the company to widen its market presence in the U.S. defense sector.

The hermetic packaging market report includes in-depth coverage of the industry with estimates & forecast in terms of revenue in USD Million from 2017 to 2027 for the following segments:

By Configuration

  • Multi-layer ceramic packages
  • Pressed ceramic packages
  • Metal can package

By Product

  • Ceramic-to-metal sealing

  • Glass-to-metal sealing
  • Passivation glass
  • Transponder glass
  • Reed glass

By Application

  • Sensors
  • Lasers
  • Transistors
  • MEMS (Microelectromechanical) switches
  • Airbag initiators
  • Photodiodes
  • Others

By Industry

  • Military & defense
  • Aerospace
  • Automotive
  • Medical
  • Telecommunication
  • Others

The above information is provided on a regional and country basis for the following:

By Region

  • North America
    • U.S.
    • Canada
  • Europe
    • Germany
    • UK
    • France
    • Spain
    • Italy
    • Russia
  • Asia Pacific
    • China
    • India
    • Japan
    • Taiwan
    • South Korea
    • Indonesia
    • Malaysia
  • Latin America
    • Brazil
    • Mexico
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE
    • Israel
Authors: Kiran Pulidindi, Saurabh Bhalerao

Frequently Asked Questions (FAQ) :

The global industry share of hermetic packaging had surpassed USD 3.1 billion in 2020 and will witness a CAGR of over 8.5% up to 2027.

Demand for hermetic packaging from metal can configuration was valued at USD 1.7 billion in 2020 and will grow with increasing penetration in hybrid and linear applications.

The glass-to-metal sealing product segment held more than 40% of the industry share driven by higher utility in automotive, aerospace, batteries, high vacuum, electronic packages, sensor packages, military, and medical sectors.

The overall industry size from the military and defense sector crossed USD 1.1 billion in 2020 and will expand with the rising expenditure mainly in the U.S.

North America could record around USD 2.1 billion through 2027 on account of the growing demand from several major end-use regional sectors.

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Premium Report Details

  • Base Year: 2020
  • Companies covered: 15
  • Tables & Figures: 203
  • Countries covered: 21
  • Pages: 200

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